Datasheet > MCFT000085

MCFT000085

更新时间： 2022-03-21 14:02:03

品牌	Logo	应用领域
其他 - ETC		电感器
页数	文件大小	规格书
10页	622K
描述
Wire Wound Chip Inductor

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MCFT000085 数据手册

Wire Wound Chip Inductor

±2%,ꢀ±3%,ꢀ±5%,ꢀ±10%

250

3.2

2.8

2.6

2.4

0.275

0.33

0.43

0.58

450

490

450

420

MCFT02 Wire Wound Chip Inductors / High SRF Type

Electrical Performance Test

Item

Requirement

Test Method

Inductance

HP4286

HP4287

SRF

Refer to standard electrical

characteristic spec.

DC Resistance RDC

Micro-Ohm meter (Gom-801G)

Appliedꢀtheꢀcurrentꢀtoꢀcoils,ꢀTheꢀinductanceꢀchangeꢀshouldꢀ

be less than 10% to initial value

Rated Current IDC

Inductors shall have no evidence

of electrical and mechanical

damage

Applied 2 times of rated allowed DC current to inductor for

a period of 5 minutes

Over Load

Inductors shall be no evidence

of electrical and mechanical

damage.

AC voltage of 500 VAC applied between inductors terminal

and case for 1 min.

Withstanding Voltage

Insulation Resistance

1,000MΩꢀmin.

100 VDC applied between inductor terminal and case

Mechanical Performance Test

Item

Requirement

Test Method

Test device shall be soldered on the substrate

Oscillation Frequency: 10 to 55 to 10Hz for 1 min.

Amplitude: 1.5 mm

Vibration

Appearance: No damage

L change: within ±5%

Q change: within ±10%

Time:ꢀ2ꢀhrsꢀforꢀeachꢀaxisꢀ(X,ꢀYꢀ&Z),ꢀtotalꢀ6ꢀhrs

Resistance to Soldering

Heat

Solder Temperature: 260±5°C

Immersion Time: 10±2 seconds

The device should be soldered (260±5 for 10 seconds) to a

tinned copper subs rate. A dynamiter force gauge should be

applied to the side of the component. The device must with

stand a minimum force of 2 or 4 pounds without a failure of

adhesion on termination

1 lbs. For 0402

2 lbs. For 0603

3 lbs. For the rest

Component Adhesion

(Push Test)

Dropping chip by each side and each corner. Drop 10 times

in total

Drop height: 100 cm

Drop weight: 125 g

Drop

No damage

Inductor shall be dipped in a melted solder bath at 245±5

for 3 seconds

Solderability

90% covered with solder

No damage on appearance and

marking

Resistance to Solvent

MIL-STD-202F,ꢀMethodꢀ215D

www.element14.com

www.farnell.com

www.newark.com

Page <7>

18/07/12 V1.0

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