是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Transferred | 包装说明: | HLFQFP, |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.72 |
JESD-30 代码: | S-PQFP-G48 | JESD-609代码: | e3 |
长度: | 7 mm | 湿度敏感等级: | 3 |
功能数量: | 1 | 端子数量: | 48 |
最高工作温度: | 125 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | HLFQFP |
封装形状: | SQUARE | 封装形式: | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 260 | 座面最大高度: | 1.6 mm |
表面贴装: | YES | 电信集成电路类型: | INTERFACE CIRCUIT |
温度等级: | AUTOMOTIVE | 端子面层: | MATTE TIN |
端子形式: | GULL WING | 端子节距: | 0.5 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 7 mm | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
MC33907NAE | NXP |
完全替代 |
System Basis Chip, CAN, 5V , 0.7A VCORE, QFP 48, Tray |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MC33907LAE | NXP |
获取价格 |
System Basis Chip, CAN/LIN, 5V , 0.7A VCORE, QFP 48, Tray | |
MC33907NAE | NXP |
获取价格 |
System Basis Chip, CAN, 5V , 0.7A VCORE, QFP 48, Tray | |
MC33908LAE | NXP |
获取价格 |
暂无描述 | |
MC33908LAER2 | NXP |
获取价格 |
System Basis Chip, CAN/LIN, 5V , 1.5A VCORE, QFP 48, Reel | |
MC33908NAE | NXP |
获取价格 |
System Basis Chip, CAN ONLY, 5V , 1.5A VCORE, QFP 48, Tray | |
MC33909Q3AD | NXP |
获取价格 |
POWER SUPPLY MANAGEMENT CKT | |
MC33909Q5AD | NXP |
获取价格 |
System Basis Chip, 1 CAN, 4 LIN, 6 MSDI, 2A DC/DC, LV124, 5V/500mA LDO, LQFP-EP 48, Tray | |
MC33910 | FREESCALE |
获取价格 |
LIN System Basis Chip with High Side Drivers | |
MC33910BAC | FREESCALE |
获取价格 |
LIN System Basis Chip with 2x60mA High Side Drivers | |
MC33910BAC | NXP |
获取价格 |
System Basis Chip, LIN, 1x 5.0V/60mA LDOs, High-Side Drivers, QFP 32 |