Datasheet > MC33742PEGR2

MC33742PEGR2

更新时间： 2024-01-17 21:55:55

品牌	Logo	应用领域
恩智浦 - NXP		/
页数	文件大小	规格书
72页	1211K
描述
System Basis Chip, CAN, 2x 5.0V/200mA LDOs, 4 wake ups, 15 ms reset duration, SOIC 28, Reel

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MC33742PEGR2 技术参数

ADDITIONAL DOCUMENTATION

THERMAL ADDENDUM (REV 2.0)

Device on Thermal Test Board

Material:

Single layer printed circuit board

FR4, 1.6 mm thickness

Cu traces, 0.07 mm thickness

Outline:

80 mm x 100 mm board area,

including edge connector for thermal

testing

Area A:

Cu heat-spreading areas on board

surface

Ambient Conditions: Natural convection, still air

Table 45. Thermal Resistance Performance

R_θJA[°C/W]

[mm²]

300

600

R_JAis the thermal resistance between die junction and ambient air.

R_

300

Heat spreading area [mm²]

600

Figure 40. Device on Thermal Test Board R_JA

33742

Analog Integrated Circuit Device Data

Freescale Semiconductor

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型号	品牌	描述	获取价格	数据表
MC33742PEP	NXP	System Basis Chip, CAN, 2x 5.0V/200mA LDOs, 4 wake ups, 15 ms reset duration, QFN 48, Tray	获取价格
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MC33742SDW	MOTOROLA	System Basis Chip (SBC) with Enhanced High-Speed CAN Transceiver	获取价格
MC33742SDW	FREESCALE	System Basis Chip with Enhanced High Speed CAN Transceiver	获取价格
MC33742SDWR2	MOTOROLA	System Basis Chip (SBC) with Enhanced High-Speed CAN Transceiver	获取价格
MC33742SDWR2	FREESCALE	System Basis Chip (SBC) with Enhanced High-Speed CAN Transceiver	获取价格