MBRP20060CT
Preferred Device
POWERTAPt II
SWITCHMODEt
Power Rectifier
These state−of−the−art devices use the Schottky Barrier principle
with a platinum barrier metal.
http://onsemi.com
Features
SCHOTTKY
BARRIER RECTIFIER
200 AMPERES, 60 VOLTS
• Dual Diode Construction − May Be Paralleled for Higher Current
Output
• Guardring for Stress Protection
• Low Forward Voltage
• 150°C Operating Junction Temperature
• Pb−Free Package is Available*
1
3
2
Mechanical Characteristics:
• Case: Epoxy, Molded with metal heatsink base
• Weight: 80 Grams (Approximately)
• Finish: All External Surfaces Corrosion Resistant
• Top Terminal Torque: 25−40 lb−in max
• Base Plate Torques: See procedure given in the Package Outline
Section
2
1
MAXIMUM RATINGS
POWERTAP II
CASE 357C
PLASTIC
3
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
V
60
V
RRM
RWM
V
R
MARKING DIAGRAM
Average Rectified Forward Current
I
A
A
F(AV)
100
200
(Rated V , T = 140°C)
Per Leg
R
C
Per Device
Peak Repetitive Forward Current,
(Rated V , Square Wave,
I
FRM
MCC
AYYWWG
R
B20060T
20 kHz, T = 140°C)
Per Leg
C
200
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
I
1500
A
A
FSM
B20060T = Specific Device Code
MCC
A
YY
WW
G
= Mold Compound Code
= Assembly Location
= Year
Peak Repetitive Reverse Current
(2.0 ms, 1.0 kHz)
I
RRM
Per Leg
2.0
Storage Temperature Range
T
−55 to +150
−55 to +150
10,000
°C
°C
= Work Week
stg
= Pb−Free Package
Operating Junction Temperature
T
J
Voltage Rate of Change (Rated V )
dv/dt
V/ms
R
ORDERING INFORMATION
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
Device
MBRP20060CT
Package
Shipping
25 Units/Tray
POWERTAP II
MBRP20060CTG POWERTAP II 25 Units/Tray
(Pb−Free)
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Preferred devices are recommended choices for future use
and best overall value.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
September, 2006 − Rev. 4
MBRP20060CT/D