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MBRP20060CT PDF预览

MBRP20060CT

更新时间: 2024-02-20 18:27:55
品牌 Logo 应用领域
安森美 - ONSEMI 二极管开关局域网
页数 文件大小 规格书
6页 174K
描述
POWERTAP II SWITCHMODE Power Rectifier

MBRP20060CT 数据手册

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MBRP20060CT  
Preferred Device  
POWERTAPt II  
SWITCHMODEt  
Power Rectifier  
These stateoftheart devices use the Schottky Barrier principle  
with a platinum barrier metal.  
http://onsemi.com  
Features  
SCHOTTKY  
BARRIER RECTIFIER  
200 AMPERES, 60 VOLTS  
Dual Diode Construction May Be Paralleled for Higher Current  
Output  
Guardring for Stress Protection  
Low Forward Voltage  
150°C Operating Junction Temperature  
PbFree Package is Available*  
1
3
2
Mechanical Characteristics:  
Case: Epoxy, Molded with metal heatsink base  
Weight: 80 Grams (Approximately)  
Finish: All External Surfaces Corrosion Resistant  
Top Terminal Torque: 2540 lbin max  
Base Plate Torques: See procedure given in the Package Outline  
Section  
2
1
MAXIMUM RATINGS  
POWERTAP II  
CASE 357C  
PLASTIC  
3
Rating  
Symbol  
Value  
Unit  
Peak Repetitive Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
V
V
60  
V
RRM  
RWM  
V
R
MARKING DIAGRAM  
Average Rectified Forward Current  
I
A
A
F(AV)  
100  
200  
(Rated V , T = 140°C)  
Per Leg  
R
C
Per Device  
Peak Repetitive Forward Current,  
(Rated V , Square Wave,  
I
FRM  
MCC  
AYYWWG  
R
B20060T  
20 kHz, T = 140°C)  
Per Leg  
C
200  
NonRepetitive Peak Surge Current  
(Surge Applied at Rated Load Conditions  
Halfwave, Single Phase, 60 Hz)  
I
1500  
A
A
FSM  
B20060T = Specific Device Code  
MCC  
A
YY  
WW  
G
= Mold Compound Code  
= Assembly Location  
= Year  
Peak Repetitive Reverse Current  
(2.0 ms, 1.0 kHz)  
I
RRM  
Per Leg  
2.0  
Storage Temperature Range  
T
55 to +150  
55 to +150  
10,000  
°C  
°C  
= Work Week  
stg  
= PbFree Package  
Operating Junction Temperature  
T
J
Voltage Rate of Change (Rated V )  
dv/dt  
V/ms  
R
ORDERING INFORMATION  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
Device  
MBRP20060CT  
Package  
Shipping  
25 Units/Tray  
POWERTAP II  
MBRP20060CTG POWERTAP II 25 Units/Tray  
(PbFree)  
*For additional information on our PbFree strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
Preferred devices are recommended choices for future use  
and best overall value.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
September, 2006 Rev. 4  
MBRP20060CT/D  

MBRP20060CT 替代型号

型号 品牌 替代类型 描述 数据表
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