是否Rohs认证: | 符合 | 生命周期: | Transferred |
零件包装代码: | TSSOP | 包装说明: | TSSOP, TSSOP16,.25 |
针数: | 16 | Reach Compliance Code: | compliant |
风险等级: | 5.71 | 位大小: | 8 |
CPU系列: | F2MC-8 | JESD-30 代码: | R-PDSO-G16 |
端子数量: | 16 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TSSOP | 封装等效代码: | TSSOP16,.25 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE |
电源: | 5 V | 认证状态: | Not Qualified |
RAM(字节): | 496 | ROM(单词): | 12288 |
ROM可编程性: | FLASH | 速度: | 16.25 MHz |
子类别: | Microcontrollers | 最大压摆率: | 13.8 mA |
标称供电电压: | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子形式: | GULL WING | 端子节距: | 0.635 mm |
端子位置: | DUAL | uPs/uCs/外围集成电路类型: | MICROCONTROLLER |
Base Number Matches: | 1 |
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