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MAX96705AGTJ/V+ PDF预览

MAX96705AGTJ/V+

更新时间: 2022-06-24 15:44:39
品牌 Logo 应用领域
美信 - MAXIM /
页数 文件大小 规格书
83页 1574K
描述
16-Bit GMSL Serializer with High-Immunity/ Bandwidth Mode and Coax/STP Cable Drive

MAX96705AGTJ/V+ 数据手册

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MAX96705A  
16-Bit GMSL Serializer with High-Immunity/  
Bandwidth Mode and Coax/STP Cable Drive  
Absolute Maximum Ratings  
AVDD to EP* ........................................................-0.5V to +1.9V  
DVDD to EP*........................................................-0.5V to +1.9V  
IOVDD to EP*.......................................................-0.5V to +3.9V  
OUT+, OUT- to EP*..............................................-0.5V to +1.9V  
All Other Pins to EP*............................-0.5V to (IOVDD + 0.5V)  
OUT+, OUT- Short Circuit to Ground or Supply........Continuous  
Continuous Power Dissipation, T = +70°C  
A
TQFN (derate 34.5 mW/°C above +70°C) .............2758.6mW  
Operating Temperature Range..........................-40°C to +115°C  
Junction Temperature......................................................+150°C  
Storage Temperature Range............................ -40°C to +150°C  
Soldering Temperature (reflow).......................................+260°C  
*EP connected to IC ground.  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these  
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect  
device reliability.  
Package Information  
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”,  
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing  
pertains to the package regardless of RoHS status.  
32-Pin TQFN-EP  
Package Code  
T3255+8  
21-0140  
90-0013  
Outline Number  
Land Pattern Number  
Single-Layer Board:  
Junction-to-Ambient Thermal Resistance (θ  
)
)
47  
JA  
Junction-to-Case Thermal Resistance (θ  
)
1.7  
JC  
Four-Layer Board:  
Junction-to-Ambient Thermal Resistance (θ  
Junction-to-Case Thermal Resistance (θ  
29  
JA  
)
1.7  
JC  
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.  
For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.  
Maxim Integrated  
6  
www.maximintegrated.com  

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