Datasheet > MAX96705

MAX96705

更新时间： 2023-12-20 18:44:10

品牌	Logo	应用领域
亚德诺 - ADI		驱动
页数	文件大小	规格书
83页	2204K
描述
16位GMSL串行器，带高抗扰性/高带宽模式和同轴或STP电缆驱动

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中文翻译

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数据手册

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MAX96705 数据手册

MAX96705

16-Bit GMSL Serializer with High-Immunity/

Bandwidth Mode and Coax/STP Cable Drive

Absolute Maximum Ratings

AVDD to EP* ........................................................-0.5V to +1.9V

DVDD to EP*........................................................-0.5V to +1.9V

IOVDD to EP*.......................................................-0.5V to +3.9V

OUT+, OUT- to EP*..............................................-0.5V to +1.9V

All Other Pins to EP*............................-0.5V to (IOVDD + 0.5V)

OUT+, OUT- Short Circuit to Ground or Supply........Continuous

Continuous Power Dissipation, T = +70°C

TQFN (derate 34.5 mW/°C above +70°C) .............2758.6mW

Operating Temperature Range..........................-40°C to +115°C

Junction Temperature......................................................+150°C

Storage Temperature Range............................ -40°C to +150°C

Soldering Temperature (reflow).......................................+260°C

*EP connected to IC ground.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Information

For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”,

“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing

pertains to the package regardless of RoHS status.

32-Pin TQFN-EP

Package Code

T3255+8

21-0140

90-0013

Outline Number

Land Pattern Number

Single-Layer Board:

Junction-to-Ambient Thermal Resistance (θ

)

Junction-to-Case Thermal Resistance (θ

)

1.7

Four-Layer Board:

Junction-to-Ambient Thermal Resistance (θ

Junction-to-Case Thermal Resistance (θ

)

1.7

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.

For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

Maxim Integrated

│ 6

www.maximintegrated.com

1...3 4 567 8 9...83

中文翻译

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与MAX96705相关器件

型号	品牌	获取价格	描述	数据表
MAX96705A	MAXIM	获取价格	16-Bit GMSL Serializer with High-Immunity/ Bandwidth Mode and Coax/STP Cable Drive
MAX96705AGTJ/V+	MAXIM	获取价格	16-Bit GMSL Serializer with High-Immunity/ Bandwidth Mode and Coax/STP Cable Drive
MAX96705AGTJ/V+T	MAXIM	获取价格	16-Bit GMSL Serializer with High-Immunity/ Bandwidth Mode and Coax/STP Cable Drive
MAX96705GTJ/V+	MAXIM	获取价格	Line Driver,
MAX96705GTJ/V+T	MAXIM	获取价格	Line Driver,
MAX96706	MAXIM	获取价格	14-Bit GMSL Deserializer with Coax or STP Cable Input
MAX96706	ADI	获取价格	14位GMSL解串器，带同轴或STP电缆输入
MAX96706_V01	MAXIM	获取价格	14-Bit GMSL Deserializer with Coax or STP Cable Input
MAX96706GTJ/V+	MAXIM	获取价格	Line Receiver,
MAX96706GTJ/V+T	MAXIM	获取价格	Line Receiver,

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