是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Active | 零件包装代码: | BGA |
包装说明: | BUMP, UCSP-4 | 针数: | 4 |
Reach Compliance Code: | not_compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.15 |
Is Samacsys: | N | 可调阈值: | NO |
模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT | JESD-30 代码: | S-PBGA-B4 |
JESD-609代码: | e0 | 长度: | 1.1 mm |
湿度敏感等级: | 1 | 信道数量: | 1 |
功能数量: | 1 | 端子数量: | 4 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | VFBGA |
封装等效代码: | BGA4,2X2,20 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | NOT SPECIFIED |
电源: | 1.2/5.5 V | 认证状态: | Not Qualified |
座面最大高度: | 0.67 mm | 子类别: | Power Management Circuits |
最大供电电流 (Isup): | 0.00175 mA | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 1.2 V | 标称供电电压 (Vsup): | 3 V |
表面贴装: | YES | 技术: | BICMOS |
温度等级: | INDUSTRIAL | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | BALL | 端子节距: | 0.5 mm |
端子位置: | BOTTOM | 阈值电压标称: | +3.4V |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 1.1 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MAX6410BS35+ | MAXIM |
获取价格 |
Power Supply Support Circuit, Fixed, 1 Channel, BICMOS, PBGA4, LEAD FREE, BUMP, UCSP-4 | |
MAX6410BS35+T | MAXIM |
获取价格 |
Power Supply Support Circuit, Fixed, 1 Channel, BICMOS, PBGA4, LEAD FREE, BUMP, UCSP-4 | |
MAX6410BS35-T | MAXIM |
获取价格 |
Voltage Detectors in 4-Bump (2 X 2) Chip-Scale Package | |
MAX6410BS36+T | MAXIM |
获取价格 |
Power Supply Support Circuit, Fixed, 1 Channel, BICMOS, PBGA4, LEAD FREE, BUMP, UCSP-4 | |
MAX6410BS36-T | MAXIM |
获取价格 |
Voltage Detectors in 4-Bump (2 X 2) Chip-Scale Package | |
MAX6410BS37-T | MAXIM |
获取价格 |
Voltage Detectors in 4-Bump (2 X 2) Chip-Scale Package | |
MAX6410BS38+T | MAXIM |
获取价格 |
Power Supply Support Circuit, Fixed, 1 Channel, BICMOS, PBGA4, LEAD FREE, BUMP, UCSP-4 | |
MAX6410BS38-T | MAXIM |
获取价格 |
Voltage Detectors in 4-Bump (2 X 2) Chip-Scale Package | |
MAX6410BS39+T | MAXIM |
获取价格 |
Power Supply Support Circuit, Fixed, 1 Channel, BICMOS, PBGA4, LEAD FREE, BUMP, UCSP-4 | |
MAX6410BS39-T | MAXIM |
获取价格 |
Voltage Detectors in 4-Bump (2 X 2) Chip-Scale Package |