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MAX3863ETJ+T PDF预览

MAX3863ETJ+T

更新时间: 2024-01-12 20:32:49
品牌 Logo 应用领域
美信 - MAXIM 接口集成电路
页数 文件大小 规格书
15页 400K
描述
Interface Circuit, BIPolar, ROHS COMPLIANT, TQFN-32

MAX3863ETJ+T 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:QFN
包装说明:HVQCCN, LCC32,.2SQ,20针数:32
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.81
接口集成电路类型:INTERFACE CIRCUITJESD-30 代码:S-XQCC-N32
JESD-609代码:e3长度:5 mm
湿度敏感等级:1功能数量:1
端子数量:32最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:UNSPECIFIED
封装代码:HVQCCN封装等效代码:LCC32,.2SQ,20
封装形状:SQUARE封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度):260电源:3.3 V
认证状态:Not Qualified座面最大高度:0.8 mm
子类别:Display Drivers最大供电电压:3.6 V
最小供电电压:3.15 V标称供电电压:3.3 V
表面贴装:YES技术:BIPOLAR
温度等级:INDUSTRIAL端子面层:Tin (Sn)
端子形式:NO LEAD端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:5 mmBase Number Matches:1

MAX3863ETJ+T 数据手册

 浏览型号MAX3863ETJ+T的Datasheet PDF文件第8页浏览型号MAX3863ETJ+T的Datasheet PDF文件第9页浏览型号MAX3863ETJ+T的Datasheet PDF文件第10页浏览型号MAX3863ETJ+T的Datasheet PDF文件第12页浏览型号MAX3863ETJ+T的Datasheet PDF文件第13页浏览型号MAX3863ETJ+T的Datasheet PDF文件第14页 
2.7Gbps Laser Driver with Modulation  
Compensation  
MAX863  
V
CC  
I
LASER  
POWER  
MOD1  
I
MOD2  
P1  
T1  
T2  
50Ω  
50Ω  
DATA+  
DATA-  
P
AVG  
P0  
LASER CURRENT  
I
I
BIAS2  
BIAS1  
GND  
Figure 4. Laser Power vs. Current for a Change in Temperature  
Figure 5. Equivalent Input Circuit  
I
I
= I  
+ K × I  
MOD MODS BIAS  
V
CC  
MOD MODN  
GND  
1.2V  
= 200 ×  
MODS  
R
MODSET  
5
K = 200 ×  
500+R  
MODCOMP  
Applications Information  
Layout Considerations  
To minimize loss and crosstalk, keep connections  
between the MAX3863 output and the laser diode as  
short as possible. Use good high-frequency layout  
techniques and multilayer boards with uninterrupted  
ground plane to minimize EMI and crosstalk. Circuit  
boards should be made using low-loss dielectrics. Use  
controlled-impedance lines for the clock and data  
inputs, as well as the module output.  
I
MOD  
GND  
Figure 6. Equivalent Output Circuit  
Exposed Pad Package  
The exposed pad on the 32-pin QFN provides a very  
low thermal resistive path for heat removal from the IC.  
The pad is also electrical ground on the MAX3863 and  
must be soldered to the circuit board ground for proper  
thermal and electrical performance. Refer to Application  
Note 862: HFAN-08.1: Thermal Considerations of QFN  
and Other Exposed-Paddle Packages for additional  
information.  
Laser Safety and IEC 825  
Using the MAX3863 laser driver alone does not ensure  
that a transmitter design is compliant with IEC825. The  
entire transmitter circuit and component selections  
must be considered. Determine the level of fault toler-  
ance required by each application and recognize that  
Maxim products are not designed or authorized for use  
as components in systems intended for surgical im-  
plant into the body, for applications intended to support  
or sustain life, or for any other application where the  
failure of a Maxim product could create a situation  
where personal injury or death may occur.  
______________________________________________________________________________________ 11  

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