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MAX3750CEE-T PDF预览

MAX3750CEE-T

更新时间: 2024-02-09 11:28:22
品牌 Logo 应用领域
美信 - MAXIM 电信光电二极管电信集成电路
页数 文件大小 规格书
7页 113K
描述
Telecom Circuit, 1-Func, Bipolar, PDSO16, 0.150 INCH, 0.025 INCH PITCH, MO-137, QSOP-16

MAX3750CEE-T 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:SSOP
包装说明:0.150 INCH, 0.025 INCH PITCH, MO-137, QSOP-16针数:16
Reach Compliance Code:not_compliantHTS代码:8542.39.00.01
风险等级:5.1JESD-30 代码:R-PDSO-G16
JESD-609代码:e0长度:4.9 mm
湿度敏感等级:1功能数量:1
端子数量:16最高工作温度:70 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:HSSOP封装等效代码:SSOP16,.25
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
峰值回流温度(摄氏度):245电源:3.3 V
认证状态:Not Qualified座面最大高度:1.75 mm
子类别:Other Telecom ICs最大压摆率:0.084 mA
标称供电电压:3.3 V表面贴装:YES
技术:BIPOLAR电信集成电路类型:TELECOM CIRCUIT
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn85Pb15)
端子形式:GULL WING端子节距:0.635 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:3.9 mmBase Number Matches:1

MAX3750CEE-T 数据手册

 浏览型号MAX3750CEE-T的Datasheet PDF文件第1页浏览型号MAX3750CEE-T的Datasheet PDF文件第3页浏览型号MAX3750CEE-T的Datasheet PDF文件第4页浏览型号MAX3750CEE-T的Datasheet PDF文件第5页浏览型号MAX3750CEE-T的Datasheet PDF文件第6页浏览型号MAX3750CEE-T的Datasheet PDF文件第7页 
Maxim Product Naming Conventions - Maxim  
E = Number of Pins category E (16 pins)  
Please note that suffix codes are not always consistent across different product  
types. Always refer to the data sheet for details and specifications.  
Temperature Ranges  
A
Automotive AEC-Q100 Grade -40°C to +125°C  
1
C
E
G
Commercial  
Extended  
0°C to +70°C  
-40°C to +85°C  
Automotive AEC-Q100 Grade -40°C to +105°C  
2
I
Industrial  
-20°C to +85°C  
-55°C to +125°C  
M Military  
T
Automotive AEC-Q100 Grade -40°C to +150°C  
0
U
Upper Commercial  
0°C to +85°C  
Package Type  
A
SSOP (Shrink Small Outline Package) 209 mil (14, 16, 20, 24, 28 leads); 300 mil  
(36 leads)  
B
C
C
C
D
UCSP (Ultra-Small Chip Scale Pkg)  
PLASTIC TO-92; TO-220  
LQFP 1.4mm (7mm x 7mm thru 20mm x 20mm)  
TQFP 1.0mm (7mm x 7mm thru 20mm x 20mm)  
CERAMIC SIDEBRAZE 300 mil (8, 14, 16, 18, 20 leads); 600 mil (24, 28, 40, 48  
leads)  
E
F
QSOP (Quarter Small Outline Package)  
CERAMIC FLATPACK  
G
G
H
H
METAL CAN (Gold)  
QFN (Plastic, Very Thin, Quad Flat No Lead - Punch Version) 0.9mm  
SBGA (Super Ball Grid Array)  
TQFP 1.0mm 5mm x 5mm (32 leads)  
https://www.maximintegrated.com/en/design/packaging/package-i... 4/14/2016  

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