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MAX3750CEE-T PDF预览

MAX3750CEE-T

更新时间: 2024-02-24 06:57:33
品牌 Logo 应用领域
美信 - MAXIM 电信光电二极管电信集成电路
页数 文件大小 规格书
7页 113K
描述
Telecom Circuit, 1-Func, Bipolar, PDSO16, 0.150 INCH, 0.025 INCH PITCH, MO-137, QSOP-16

MAX3750CEE-T 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:SSOP
包装说明:0.150 INCH, 0.025 INCH PITCH, MO-137, QSOP-16针数:16
Reach Compliance Code:not_compliantHTS代码:8542.39.00.01
风险等级:5.1JESD-30 代码:R-PDSO-G16
JESD-609代码:e0长度:4.9 mm
湿度敏感等级:1功能数量:1
端子数量:16最高工作温度:70 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:HSSOP封装等效代码:SSOP16,.25
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
峰值回流温度(摄氏度):245电源:3.3 V
认证状态:Not Qualified座面最大高度:1.75 mm
子类别:Other Telecom ICs最大压摆率:0.084 mA
标称供电电压:3.3 V表面贴装:YES
技术:BIPOLAR电信集成电路类型:TELECOM CIRCUIT
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn85Pb15)
端子形式:GULL WING端子节距:0.635 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:3.9 mmBase Number Matches:1

MAX3750CEE-T 数据手册

 浏览型号MAX3750CEE-T的Datasheet PDF文件第1页浏览型号MAX3750CEE-T的Datasheet PDF文件第2页浏览型号MAX3750CEE-T的Datasheet PDF文件第4页浏览型号MAX3750CEE-T的Datasheet PDF文件第5页浏览型号MAX3750CEE-T的Datasheet PDF文件第6页浏览型号MAX3750CEE-T的Datasheet PDF文件第7页 
Maxim Product Naming Conventions - Maxim  
H
TSSOP (Thin Shrink Small Outline Package) 4.4mm (8 leads)  
J
CERDIP (Ceramic Dual-Inline) (N) 300 mil (8, 14, 16, 18, 20 leads); (W) 600 mil  
(24, 28, 40 leads)  
K
L
SOT 1.23mm (8 Leads)  
LCC (Leadless Ceramic Chip Carrier) (18, 20, 28 leads)  
FCLGA (Flip Chip Land Grid Array); THIN LGA (Thin Land Grid Array) 0.8mm  
µDFN (Micro Dual Flat No Lead) (6, 8, 10 leads)  
L
L
M
MQFP (Metric Quad Flat Pack) over 1.4mm; ED-QUAD (28mm x 28mm 160  
leads)  
N
P
PDIP (Narrow Plastic Dual-Inline) 300 mil (24, 28 leads)  
PDIP (Plastic Dual-Inline) 300 mil (8, 14, 16, 18, 20 leads); 600 mil (24, 28, 40  
leads)  
Q
R
S
T
PLCC (Plastic Leaded Chip Carrier)  
CERDIP (Narrow Ceramic Dual-Inline) 300 mil (24, 28 leads)  
SOIC (Narrow Plastic Small Outline) 150 mil  
METAL CAN (Nickel)  
T
TDFN (Plastic, Very Very Thin, Dual Flat No Lead - Sawn Version) 0.9mm (6, 8,  
10, 14 leads)  
T
THIN QFN (Plastic, Very Very Thin, Quad Flat No Lead - Sawn Version) 0.8mm  
TQ THIN QFN (Plastic, Very Very Thin, Quad Flat No Lead - Sawn Version) 0.8mm  
(8 leads)  
U
U
SOT 1.23mm (3, 4, 5, 6 leads)  
TSSOP (Thin Shrink Small Outline Package) 4.4mm (14, 16, 20, 24, 28, 38, 56  
leads); 6.1mm (48 leads)  
U
V
µMAX (Thin Shrink Small Outline Package) 3mm x 3mm (8, 10 leads)  
U. TQFN (Ultra Thin QFN -Plastic Ultra Thin Quad Flat No Lead - Sawn version)  
0.55mm  
W SOIC (Wide Plastic Small Outline) 300 mil  
W WLP (Wafer Level Pkg)  
X
X
CSBGA 1.4mm  
CVBGA 1.0mm  
https://www.maximintegrated.com/en/design/packaging/package-i... 4/14/2016  

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