MAX3724E/D

更新时间： 2024-02-20 00:54:31

品牌	Logo	应用领域
美信 - MAXIM		放大器
页数	文件大小	规格书
10页	342K
描述
Telecom Circuit, 1-Func, Bipolar, 0.030 X 0.050 INCH, DIE-10

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技术参数
数据手册

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MAX3724E/D 技术参数

是否无铅：	含铅	是否Rohs认证：	不符合
生命周期：	Obsolete	零件包装代码：	DIE
包装说明：	DIE, DIE OR CHIP	针数：	10
Reach Compliance Code：	not_compliant	ECCN代码：	EAR99
HTS代码：	8542.33.00.01	风险等级：	5.92
JESD-30 代码：	R-XUUC-N10	JESD-609代码：	e0
功能数量：	1	端子数量：	10
最高工作温度：	85 °C	最低工作温度：	-40 °C
封装主体材料：	UNSPECIFIED	封装代码：	DIE
封装等效代码：	DIE OR CHIP	封装形状：	RECTANGULAR
封装形式：	UNCASED CHIP	峰值回流温度（摄氏度）：	NOT SPECIFIED
电源：	3.3 V	认证状态：	Not Qualified
子类别：	Other Telecom ICs	最大压摆率：	0.041 mA
标称供电电压：	3.3 V	表面贴装：	YES
技术：	BIPOLAR	电信集成电路类型：	TELECOM CIRCUIT
温度等级：	INDUSTRIAL	端子面层：	TIN LEAD
端子形式：	NO LEAD	端子位置：	UPPER
处于峰值回流温度下的最长时间：	NOT SPECIFIED	Base Number Matches：	1

MAX3724E/D 数据手册

3.2Gbps SFP Transimpedance

Amplifiers with RSSI

Current generated by supply noise voltage is divided

between C and C . The input noise current due

to supply noise is (assuming the filter capacitor is much

larger than the photodiode capacitance):

Layout Considerations

Noise performance and bandwidth are adversely affect-

ed by capacitance at the IN pad. Minimize capacitance

on this pad and select a low-capacitance photodiode.

Assembling the MAX3724/MAX3725 in die form using

chip and wire technology provides the best possible

performance. Figure 7 shows a suggested layout for a

TO header for the MAX3724/MAX3725. The placement

of the filter cap to minimize the ground loop of the pho-

todiode is required to achieve the specified bandwidth.

The OUT+ and OUT- bond wire lengths should also be

minimized to meet the bandwidth specification. Special

care should be taken to ensure that ESD at IN does not

exceed 500V.

FILTER

= (V

)(C ) / (R

)(C

)

NOISE

FILTER

If the amount of tolerable noise is known, the filter

capacitor can be easily selected:

= (V

)(C ) / (R

)(I

)

FILTER

NOISE

FILTER NOISE

For example, with maximum noise voltage = 100mV

P-P

selected to

= 0.85pF, R

= 600Ω, and I

FILTER

NOISE

be 350nA:

FILTER

= (100mV)(0.85pF) / (600Ω)(350nA) = 405pF

Wire Bonding

Photodiode Filter

For high-current density and reliable operation, the

MAX3724/MAX3725 use gold metalization. Connections

to the die should be made with gold wire only, using ball-

bonding techniques. Die thickness is typically 14 mils

(0.4mm).

Supply voltage noise at the cathode of the photodiode

produces a current I = C

∆V/∆t, which reduces the

is the photodiode capaci-

tance.) The filter resistor of the MAX3724/MAX3725,

combined with an external capacitor, can be used to

reduce this noise (see the Typical Application Circuit).

receiver sensitivity (C

TOP VIEW OF TO-46 HEADER

CASE

400pF TO

GROUND

1000pF

400pF TO

1000pF

PHOTODIODE

OUT-

AVG

OUT+

TIME

MAX3724

MAX3725

Figure 7. Suggested Layout for TO-46 Header

Figure 6. Optical Power Relations

_______________________________________________________________________________________

1...6 7 8910

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与MAX3724E/D相关器件

型号	品牌	描述	获取价格	数据表
MAX3724EVKIT\|MAX3725EVKIT	MAXIM	Evaluation Kit for the MAX3724/MAX3725	获取价格
MAX3724-MAX3725	MAXIM	3.2Gbps SFP Transimpedance Amplifiers with RSSI	获取价格
MAX3725	MAXIM	3.2Gbps SFP Transimpedance Amplifiers with RSSI	获取价格
MAX3725D	MAXIM	3.2Gbps SFP Transimpedance Amplifiers with RSSI	获取价格
MAX3725E	MAXIM	3.2Gbps SFP Transimpedance Amplifiers with RSSI	获取价格
MAX3735	MAXIM	2.7Gbps, Low-Power SFP Laser Drivers	获取价格

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