是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | QFN | 包装说明: | 5 X 5 MM, 0.90 MM HEIGHT, QFN-28 |
针数: | 28 | Reach Compliance Code: | not_compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.39.00.01 |
风险等级: | 5.63 | JESD-30 代码: | S-XQCC-N28 |
JESD-609代码: | e0 | 长度: | 5 mm |
湿度敏感等级: | 1 | 功能数量: | 1 |
端子数量: | 28 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | UNSPECIFIED |
封装代码: | HVQCCN | 封装等效代码: | LCC28,.2SQ,20 |
封装形状: | SQUARE | 封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度): | 240 | 电源: | 3/3.3 V |
认证状态: | Not Qualified | 座面最大高度: | 0.9 mm |
子类别: | Other Telecom ICs | 最大压摆率: | 0.0415 mA |
标称供电电压: | 2.75 V | 表面贴装: | YES |
电信集成电路类型: | BASEBAND CIRCUIT | 温度等级: | INDUSTRIAL |
端子面层: | Tin/Lead (Sn85Pb15) | 端子形式: | NO LEAD |
端子节距: | 0.5 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | 20 | 宽度: | 5 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MAX2308EGI-T | MAXIM |
获取价格 |
暂无描述 | |
MAX2308ETI | ROCHESTER |
获取价格 |
TELECOM, CELLULAR, BASEBAND CIRCUIT, QCC28, 5 X 5 MM, 0.80 MM HEIGHT, TQFN-28 | |
MAX2308ETI+ | ROCHESTER |
获取价格 |
TELECOM, CELLULAR, BASEBAND CIRCUIT, QCC28, 5 X 5 MM, 0.80 MM HEIGHT, TQFN-28 | |
MAX2308ETI-T | MAXIM |
获取价格 |
Baseband Circuit, 5 X 5 MM, 0.80 MM HEIGHT, TQFN-28 | |
MAX2308EVKIT | MAXIM |
获取价格 |
Evaluation Kits for the MAX2306/MAX2308/MAX2309 | |
MAX2309 | MAXIM |
获取价格 |
CDMA IF VGAs and I/Q Demodulators with VCO and Synthesizer | |
MAX2309 | ADI |
获取价格 |
CDMA IF VGA及I/Q解调器,带有VCO及合成器 | |
MAX2309EGI | MAXIM |
获取价格 |
CDMA IF VGAs and I/Q Demodulators with VCO and Synthesizer | |
MAX2309EGI-T | MAXIM |
获取价格 |
Baseband Circuit, 5 X 5 MM, 0.90 MM HEIGHT, QFN-28 | |
MAX2309ETI | MAXIM |
获取价格 |
暂无描述 |