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MAX20335GEWX+ PDF预览

MAX20335GEWX+

更新时间: 2024-02-28 07:44:05
品牌 Logo 应用领域
美信 - MAXIM /
页数 文件大小 规格书
67页 1595K
描述
Power Management Circuit,

MAX20335GEWX+ 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:,Reach Compliance Code:unknown
Base Number Matches:1

MAX20335GEWX+ 数据手册

 浏览型号MAX20335GEWX+的Datasheet PDF文件第3页浏览型号MAX20335GEWX+的Datasheet PDF文件第4页浏览型号MAX20335GEWX+的Datasheet PDF文件第5页浏览型号MAX20335GEWX+的Datasheet PDF文件第7页浏览型号MAX20335GEWX+的Datasheet PDF文件第8页浏览型号MAX20335GEWX+的Datasheet PDF文件第9页 
MAX20335  
PMIC with Ultra-Low I Voltage Regulators and  
Q
Battery Chargers for Small Lithium Ion Systems  
Absolute Maximum Ratings  
(Voltages referenced to GND.)  
SDA, SCL, THM, RST, SYS, PFN1, PFN2,  
MPC0, MPC1, INT, MON, BAT, LED,  
L1IN, L2IN, L3IN.............................................. -0.3V to +6.0V  
Continuous Current into CHGIN, BAT, SYS ................±1000mA  
Continuous Current into any other terminal ..................±100mA  
Continuous Power Dissipation (multilayer board at +70°C):  
6 x 6 Array 36-Bump 2.72mm x 2.47mm  
B1LX, B2LX, B1OUT, B2OUT, EXT ...... -0.3V to (V  
+ 0.3V)  
+ 0.3V)  
+ 0.3V)  
+ 0.3V)  
0.4mm Pitch WLP (derate 21.70mW/°C).......................1.74W  
Operating Temperature Range........................... -40°C to +85°C  
Junction Temperature......................................................+150°C  
Storage Temperature Range............................ -65°C to +150°C  
Soldering Temperature (reflow).......................................+260°C  
SYS  
L1IN  
L2IN  
L3IN  
L1OUT................................................... -0.3V to (V  
L2OUT................................................... -0.3V to (V  
L3OUT................................................... -0.3V to (V  
CHGIN .................................................................... -6V to +30V  
CAP ................................... -0.3V to min (|V | + 0.3V, +6V)  
CHGIN  
SET .......................................................... -0.3V to V  
+ 0.3V  
BAT  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any  
other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device  
reliability.  
Package Information  
PACKAGE TYPE: 36 WLP  
Package Code  
W362D2+1  
Outline Number  
21-0897  
Land Pattern Number  
Refer to Application Note 1891  
THERMAL RESISTANCE, FOUR-LAYER BOARD  
Junction to Ambient (θ  
)
46°C/W  
JA  
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”,  
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing  
pertains to the package regardless of RoHS status.  
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.  
For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.  
Maxim Integrated  
6  
www.maximintegrated.com  

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