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MAX16122WTAH31+T

更新时间： 2024-01-10 16:34:43
品牌 Logo 应用领域
美信 - MAXIM 信息通信管理
页数 文件大小 规格书
16页 1243K
描述
Power Supply Support Circuit, Adjustable, 2 Channel, BICMOS

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MAX16122WTAH31+T 技术参数

是否Rohs认证： 符合生命周期：Active
包装说明：VFBGA,Reach Compliance Code：compliant
ECCN代码：EAR99HTS代码：8542.39.00.01
风险等级：5.6其他特性：RESET THRESHOLD VOLTAGE IS 3.08 V
可调阈值：YES模拟集成电路 - 其他类型：POWER SUPPLY SUPPORT CIRCUIT
长度：1.235 mm信道数量：2
功能数量：1最高工作温度：125 °C
最低工作温度：-40 °C封装代码：VFBGA
峰值回流温度（摄氏度）：NOT SPECIFIED座面最大高度：0.69 mm
最大供电电压 (Vsup)：5.5 V最小供电电压 (Vsup)：1.6 V
标称供电电压 (Vsup)：3 V技术：BICMOS
温度等级：AUTOMOTIVE端子节距：0.4 mm
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：0.835 mm
Base Number Matches：1

MAX16122WTAH31+T 数据手册

 浏览型号MAX16122WTAH31+T的Datasheet PDF文件第1页浏览型号MAX16122WTAH31+T的Datasheet PDF文件第3页浏览型号MAX16122WTAH31+T的Datasheet PDF文件第4页浏览型号MAX16122WTAH31+T的Datasheet PDF文件第5页浏览型号MAX16122WTAH31+T的Datasheet PDF文件第6页浏览型号MAX16122WTAH31+T的Datasheet PDF文件第7页 
MAX16122–MAX16125  
Dual Pushbutton Controllers in  
Tiny 6-Bump WLP Package  
ABSOLUTE MAXIMUM RATINGS  
(All pins referenced to GND)  
Input/Output Current (all pins) ...........................................20mA  
V
..........................................................................-0.3V to +6V  
Continuous Power Dissipation (T = +70NC) (Multilayer Board)  
CC  
A
RESET, SRESET to GND  
Open-Drain..............................................................-0.3V to +6V  
Push-Pull................................................... -0.3V to (V  
MR, MR1, MR2........................................................-0.3V to +6V  
WLP (derate 10.5mW/NC above +70NC)......................840mW  
Operating Temperature Range........................ -40NC to +125NC  
Junction Temperature .....................................................+150NC  
+ 0.3V)  
CC  
o
Storage Temperature Range............................-65NC to +150 C  
Soldering Temperature (reflow) ......................................+260NC  
SEL ..........................................................................-0.3V to +6V  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-  
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect device reliability.  
PACKAGE THERMAL CHARACTERISTICS (Note 1)  
WLP  
Junction-to-Ambient Thermal Resistance (q ) ..........95°C/W  
JA  
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-  
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.  
ELECTRICAL CHARACTERISTICS  
(V  
= 1.6V to 5.5V, T = -40NC to +125NC, unless otherwise noted. Typical values are at T = +25NC.) (Note 2)  
CC  
A
A
PARAMETER  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX  
5.5  
UNITS  
Operating Voltage Range  
V
RESET state guaranteed for V  
R0.95V  
1.6  
V
V
CC  
CCUVLO  
CC  
V
Undervoltage Lockout  
V
1.25  
8
1.55  
CC  
V
= 5V, steady-state condition; MR, MR1,  
MR2, RESET, and SRESET not asserted  
CC  
V
Supply Current  
I
10  
FA  
FA  
CC  
CC  
Supply Current with Oscillator  
Running  
I
V
V
= 3V  
5
10  
CC2  
CC  
CC  
V
V
Reset Threshold  
V
falling  
-2.5%  
V
TH  
2
+2.5%  
V
%
CC  
TH  
Reset Threshold Hysteresis  
V
HYST  
CC  
Reset Threshold Tempco  
30  
ppm/oC  
V
falling at 10mV/Fs from (V + 100mV)  
TH  
CC  
V
to RESET Output Delay  
t
10  
Fs  
CC  
D
to (V - 100mV)  
TH  
Reset Timeout Period  
Manual Reset Setup Delay  
Debounce Period  
t
See Table 2  
-10  
-10  
18  
t
+10  
+10  
22  
%
%
RP  
SU  
DB  
RP  
t
Internal timing (see Tables 1a, 1b, 1c)  
t
SU  
t
20  
ms  
2
1234567...16

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