Datasheet > MAP1608STR47MMPK

MAP1608STR47MMPK

更新时间： 2024-04-09 18:58:10

品牌	Logo	应用领域
华新科技 - WALSIN		/
页数	文件大小	规格书
8页	547K
描述
Multi-Layer Power Inductor: MAP Series 0.47, 3A

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MAP1608STR47MMPK 数据手册

10. Reliability Performance

Test item

Test condition

Criteria

1. No mechanical damage

2. Inductance value should be

within ± 10 % of the initial

value

1. Solder temperature : 260 ± 5℃

2. Flux : Rosin

3. DIP time : 10 ± 1 sec

Resistance to Solder Heat

1. More than 90 % of terminal

electrode should be covered

with new solder

1. Solder temperature : 235 ± 5℃

2. Flux : Rosin

3. DIP time : 5 ± 1 sec

Solderability

1. Reflow temperature : 245℃ It

shall be soldered on the substrate

applying direction parallel to the

substrate

2. Apply force(F) : 10 N

3. Test time : 5 sec

1. No mechanical damage

2. Soldering the products on

PCB after the pulling test

force > 10 N

Adhesive Test

1. Temperature:-40 ~+ 85℃ for 30

minutes each

2. Cycle: 100 cycles

3. Measurement: at ambient

temperature 24 hours after test

completion

1. No mechanical damage

2. Inductance should be within

±10% of the initial value

Thermal Shock

1. Temperature: 85 ± 5℃

2. Testing time: 500 hrs

3. Measurement: at ambient

temperature 24 hours after test

completion

1. No mechanical damage

2. Inductance should be within

±10% of the initial value

High Temperature

Resistance

1. Temperature: 40℃ ± 2℃

2. Humidity: 90-95 % RH

3. Testing time: 500 hrs

4. Measurement: at ambient

temperature 24 hours after test

completion

1. No mechanical damage

2. Inductance should be within

±10% of the initial value

Humidity

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