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M368L3324BTM-LB3 PDF预览

M368L3324BTM-LB3

更新时间: 2024-02-09 03:01:06
品牌 Logo 应用领域
三星 - SAMSUNG 存储内存集成电路动态存储器双倍数据速率时钟
页数 文件大小 规格书
25页 462K
描述
DDR SDRAM Unbuffered Module 184pin Unbuffered Module based on 512Mb B-die with 64/72-bit Non ECC/ECC 66 TSOP-II

M368L3324BTM-LB3 技术参数

是否Rohs认证:不符合生命周期:Obsolete
零件包装代码:DIMM包装说明:DIMM, DIMM184
针数:184Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.36
风险等级:5.92Is Samacsys:N
访问模式:FOUR BANK PAGE BURST最长访问时间:0.7 ns
其他特性:AUTO/SELF REFRESH最大时钟频率 (fCLK):166 MHz
I/O 类型:COMMONJESD-30 代码:R-XDMA-N184
内存密度:2147483648 bit内存集成电路类型:DDR DRAM MODULE
内存宽度:64湿度敏感等级:1
功能数量:1端口数量:1
端子数量:184字数:33554432 words
字数代码:32000000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:32MX64输出特性:3-STATE
封装主体材料:UNSPECIFIED封装代码:DIMM
封装等效代码:DIMM184封装形状:RECTANGULAR
封装形式:MICROELECTRONIC ASSEMBLY峰值回流温度(摄氏度):225
电源:2.5 V认证状态:Not Qualified
刷新周期:8192自我刷新:YES
子类别:DRAMs最大压摆率:1.62 mA
最大供电电压 (Vsup):2.7 V最小供电电压 (Vsup):2.3 V
标称供电电压 (Vsup):2.5 V表面贴装:NO
技术:CMOS温度等级:COMMERCIAL
端子形式:NO LEAD端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

M368L3324BTM-LB3 数据手册

 浏览型号M368L3324BTM-LB3的Datasheet PDF文件第2页浏览型号M368L3324BTM-LB3的Datasheet PDF文件第3页浏览型号M368L3324BTM-LB3的Datasheet PDF文件第4页浏览型号M368L3324BTM-LB3的Datasheet PDF文件第5页浏览型号M368L3324BTM-LB3的Datasheet PDF文件第6页浏览型号M368L3324BTM-LB3的Datasheet PDF文件第7页 
256MB, 512MB, 1GB Unbuffered DIMM  
DDR SDRAM  
DDR SDRAM Unbuffered Module  
184pin Unbuffered Module based on 512Mb B-die  
with 64/72-bit Non ECC/ECC  
66 TSOP-II  
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,  
AND IS SUBJECT TO CHANGE WITHOUT NOTICE.  
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,  
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,  
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL  
INFORMATION IN THIS DOCUMENT IS PROVIDED  
ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.  
1. For updates or additional information about Samsung products, contact your nearest Samsung office.  
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar  
applications where Product failure could result in loss of life or personal or physical harm, or any military or  
defense application, or any governmental procurement to which special terms or provisions may apply.  
* Samsung Electronics reserves the right to change products or specification without notice.  
Rev. 1.1 June 2005  

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