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M032ED6AE

更新时间： 2022-05-14 22:08:30
品牌 Logo 应用领域
新唐 - NUVOTON 微控制器
页数 文件大小 规格书
274页 4826K
描述
Arm® Cortex®-M 32-bit Microcontroller

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M032ED6AE 数据手册

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M031/M032  
8 ELECTRICAL CHARACTERISTICS............................................................225  
8.1 Absolute Maximum Ratings..................................................................................... 225  
8.1.1 Voltage Characteristics................................................................................................225  
8.1.2 Current Characteristics................................................................................................225  
8.1.3 Thermal Characteristics...............................................................................................227  
8.1.4 EMC Characteristics ....................................................................................................228  
8.1.5 Package Moisture Sensitivity(MSL)...........................................................................229  
8.1.6 Soldering Profile ...........................................................................................................230  
8.2 General Operating Conditions................................................................................. 231  
8.3 DC Electrical Characteristics................................................................................... 232  
8.3.1 Supply Current Characteristics...................................................................................232  
8.3.2 On-Chip Peripheral Current Consumption................................................................235  
8.3.3 Wakeup Time from Low-Power Modes .....................................................................236  
8.3.4 I/O Current Injection Characteristics..........................................................................237  
8.3.5 I/O DC Characteristics.................................................................................................237  
8.4 AC Electrical Characteristics ................................................................................... 239  
8.4.1 48 MHz Internal High Speed RC Oscillator (HIRC).................................................239  
8.4.2 38.4 kHz Internal Low Speed RC Oscillator (LIRC) ................................................240  
8.4.3 External 4~32 MHz High Speed Crystal/Ceramic Resonator (HXT) characteristics  
241  
8.4.4 External 4~32 MHz High Speed Clock Input Signal Characteristics ....................243  
8.4.5 External 32.768 kHz Low Speed Crystal/Ceramic Resonator (LXT) characteristics  
244  
8.4.6 External 32.768 kHz Low Speed Clock Input Signal Characteristics ...................245  
8.4.7 PLL Characteristics ......................................................................................................246  
8.4.8 I/O AC Characteristics .................................................................................................247  
8.5 Analog Characteristics.............................................................................................. 248  
8.5.1 LDO ................................................................................................................................248  
8.5.2 Reset and Power Control Block Characteristics......................................................248  
8.5.3 12-bit SAR ADC............................................................................................................250  
8.5.4 Analog Comparator Controller (ACMP).....................................................................253  
8.6 Communications Characteristics ............................................................................ 254  
8.6.1 SPI Dynamic Characteristics ......................................................................................254  
8.6.2 SPI - I2S Dynamic Characteristics .............................................................................257  
8.6.3 I2C Dynamic Characteristics .......................................................................................259  
8.6.4 USCI - SPI Dynamic Characteristics .........................................................................260  
8.6.5 USCI-I2C Dynamic Characteristics ............................................................................263  
8.6.6 USB Characteristics.....................................................................................................264  
8.7 Flash DC Electrical Characteristics ........................................................................ 265  
9 PACKAGE DIMENSIONS............................................................................266  
9.1 TSSOP 20 (4.4x6.5x0.9 mm).................................................................................. 266  
Feb 25, 2019  
Page 5 of 274  
Rev. 1.01  
12345678...274

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