Datasheet > LTKAK3-066C

LTKAK3-066C

更新时间： 2023-12-06 20:13:28

品牌	Logo	应用领域
力特 - LITTELFUSE		/
页数	文件大小	规格书
4页	636K
描述
LTKAK3系列凭借基于Littelfuse Foldbak?技术（提供的箝位电压低于雪崩电压，但高于额定工作电压）的标准S.A.D.技术，可提供卓越的箝位特性。因此，任何电流传导所导致的升压都

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LTKAK3-066C 数据手册

TVS Diodes

SMTO-218 - 3 kA > LTKAK3 series

Soldering Parameters

Reﬂow Condition

Lead–free assembly

t_p

T_P

-Temperature Min (T_s(min)

-Temperature Max (T_s(max)

-Time (min to max) (t_s)

)

150°C

Ramp-up

Critical Zone

to T

Pre Heat

)

200°C

T_L

t_L

60 – 180 secs

T_s(max)

Average ramp up rate (LiquidusTemp (T_A) to peak 3°C/second max

_S(max)toT_A- Ramp-up Rate

3°C/second max

217°C

Ramp-down

T_s(min)

t_s

-Temperature (T_A) (Liquidus)

-Time (min to max) (t_s)

Preheat

Reﬂow

60 – 150 seconds

245^+0/-5°C

PeakTemperature (T_P)

25˚C

t 25˚C to Peak

Time within 5°C of actual peakTemperature (t_p)

Ramp-down Rate

30 seconds Max

6°C/second max

8 minutes Max.

245°C

Time (t)

Time 25°C to peakTemperature (T_P)

Do not exceed

Flow/Wave Soldering (Solder Dipping)

PeakTemperature :

DippingTime :

Soldering :

260^OC

10 seconds

1 time

Environmental Speciﬁcations

Physical Speciﬁcations

HighTemp. Storage

JESD22-A103

JESD22-A108

Weight

Case

Contact manufacturer

HTRB

Compound encapsulated

MSL

JESDEC-J-STD-020, Level 1

JESD22-A101

Terminal

Tin plated lead, solderable per MIL-STD-202 Method 208

H3TRB

RSH

JESD22-B106

Temperature cycling

JESD22-A104

Part Marking System

Part Numbering System

Marking Code

LTK AK3 - XXXX

Option Code

Blank Reel Tape

-TP Tube Pack

Series Type

LTKAK3-xxxC

Stand Off Voltage

YMXXX

(Please Refer to Electrical

Characteristics Chart)

Trace Code Marking

Y: Year Code

M: Month Code

Littelfuse Logo

XXX: Sequential Lot Number

Speciﬁcations are subject to change without notice.

Revision: 01/28/20

1 234

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