Datasheet > LTC3371

LTC3371

更新时间： 2022-10-12 13:23:44

品牌	Logo	应用领域
亚德诺 - ADI		/
页数	文件大小	规格书
28页	1625K
描述
20V, 4-Channel Buck DC/DC with 8x Configurable 1.5A Power Stages

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LTC3371 数据手册

LTC3376

ELECTRICAL CHARACTERISTICS

Note 1: Stresses beyond those listed under Absolute Maximum Ratings

may cause permanent damage to the device. Exposure to any Absolute

Maximum Rating condition for extended periods may affect device

reliability and lifetime.

Note 3: There will be additional switching current on V

Note 4: Total System current is defined as total current from V + V

pins.

INA-H

when all bucks are on (in Sleep), V = V

= 12V, and EXTV is boot-

INA-H

strapped to run off of a 3.3V buck.

Note 2: The LTC3376 is tested under pulsed load conditions such

Note 5: The current limit features of this part are intended to protect the

IC from short term or intermittent fault conditions. Continuous operation

above the specified maximum pin current rating may result in device

degradation over time.

that T ~ T . The LTC3376E is guaranteed to meet specifications from

0°C to 85°C junction temperature. Specifications over the –40°C to

125°C operating junction temperature range are assured by design,

characterization and correlation with statistical process controls. The

LTC3376I is guaranteed over the –40°C to 125°C operating junction

temperature range. High junction temperatures degrade operating

lifetimes; operating lifetime is derated for junction temperatures greater

than 125°C. Note that the maximum ambient temperature consistent

with these specifications is determined by specific operating conditions

in conjunction with board layout, the rated package thermal impedance

Note 6: The Soft-Start Time is the time from the start of switching until

–

– V reaches 360mV.

Note 7: The LTC3376 includes overtemperature protection which protects

the device during momentary overload conditions. Junction temperature

exceeds the maximum operating junction temperature when overtemperature

protection is active. Continuous operation above the specified maximum

operating junction temperature may impair device reliability.

and other environmental factors. The junction temperature (T in °C) is

calculated from ambient temperature (T in °C) and power dissipation (P

in Watts) according to the formula:

T = T + (P • θ )

where θ (in °C/W) is the package thermal impedance.

Rev 0

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