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LTC2954IDDB-2#TR PDF预览

LTC2954IDDB-2#TR

更新时间: 2024-02-29 15:28:40
品牌 Logo 应用领域
凌特 - Linear 微处理器控制器
页数 文件大小 规格书
16页 582K
描述
LTC2954 - Push Button On/Off Controller with µP Interrupt; Package: DFN; Pins: 8; Temperature Range: -40°C to 85°C

LTC2954IDDB-2#TR 技术参数

是否Rohs认证: 符合生命周期:Transferred
零件包装代码:DFN包装说明:HVSON, SOLCC8,.08,20
针数:8Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.39.00.01
风险等级:5.09可调阈值:YES
模拟集成电路 - 其他类型:POWER SUPPLY SUPPORT CIRCUITJESD-30 代码:R-PDSO-N8
JESD-609代码:e3长度:3 mm
湿度敏感等级:1信道数量:1
功能数量:1端子数量:8
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:HVSON
封装等效代码:SOLCC8,.08,20封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE峰值回流温度(摄氏度):260
电源:3/24 V认证状态:Not Qualified
座面最大高度:0.8 mm子类别:Power Management Circuits
最大供电电流 (Isup):0.012 mA最大供电电压 (Vsup):26.4 V
最小供电电压 (Vsup):2.7 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Matte Tin (Sn)端子形式:NO LEAD
端子节距:0.5 mm端子位置:DUAL
处于峰值回流温度下的最长时间:30宽度:2 mm
Base Number Matches:1

LTC2954IDDB-2#TR 数据手册

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LTC2954  
PACKAGE DESCRIPTIO  
DDB Package  
8-Lead Plastic DFN (3mm × 2mm)  
(Reference LTC DWG # 05-08-1702 Rev B)  
0.61 ±0.05  
(2 SIDES)  
R = 0.115  
0.40 ± 0.10  
3.00 ±0.10  
(2 SIDES)  
TYP  
5
R = 0.05  
TYP  
8
0.70 ±0.05  
2.55 ±0.05  
1.15 ±0.05  
2.00 ±0.10  
PIN 1 BAR  
TOP MARK  
PIN 1  
(2 SIDES)  
R = 0.20 OR  
0.25 × 45°  
CHAMFER  
(SEE NOTE 6)  
PACKAGE  
OUTLINE  
0.56 ± 0.05  
(2 SIDES)  
4
1
(DDB8) DFN 0905 REV B  
0.25 ± 0.05  
0.25 ± 0.05  
0.75 ±0.05  
0.200 REF  
0.50 BSC  
2.20 ±0.05  
(2 SIDES)  
0.50 BSC  
2.15 ±0.05  
(2 SIDES)  
0 – 0.05  
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS  
BOTTOM VIEW—EXPOSED PAD  
NOTE:  
1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229  
2. DRAWING NOT TO SCALE  
3. ALL DIMENSIONS ARE IN MILLIMETERS  
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE  
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE  
5. EXPOSED PAD SHALL BE SOLDER PLATED  
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE  
TS8 Package  
8-Lead Plastic TSOT-23  
(Reference LTC DWG # 05-08-1637)  
2.90 BSC  
(NOTE 4)  
0.52  
MAX  
0.65  
REF  
1.22 REF  
1.50 – 1.75  
(NOTE 4)  
2.80 BSC  
1.4 MIN  
3.85 MAX 2.62 REF  
PIN ONE ID  
RECOMMENDED SOLDER PAD LAYOUT  
PER IPC CALCULATOR  
0.22 – 0.36  
8 PLCS (NOTE 3)  
0.65 BSC  
0.80 – 0.90  
0.20 BSC  
DATUM ‘A’  
0.01 – 0.10  
1.00 MAX  
0.30 – 0.50 REF  
1.95 BSC  
0.09 – 0.20  
(NOTE 3)  
TS8 TSOT-23 0802  
NOTE:  
1. DIMENSIONS ARE IN MILLIMETERS  
2. DRAWING NOT TO SCALE  
3. DIMENSIONS ARE INCLUSIVE OF PLATING  
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR  
5. MOLD FLASH SHALL NOT EXCEED 0.254mm  
6. JEDEC PACKAGE REFERENCE IS MO-193  
2954f  
InformationfurnishedbyLinearTechnologyCorporationisbelievedtobeaccurateandreliable.However,  
no responsibility is assumed for its use. Linear Technology Corporation makes no representation that  
the interconnection of its circuits as described herein will not infringe on existing patent rights.  
15  

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