Datasheet > LTC2636HMS-LMI12

LTC2636HMS-LMI12

更新时间： 2022-12-20 08:04:16

品牌	Logo	应用领域
凌特 - Linear		/
页数	文件大小	规格书
24页	350K
描述
Octal 12-/10-/8-Bit SPI VOUT DACs with10ppm/°C Reference

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LTC2636HMS-LMI12 数据手册

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LTC2636

PACKAGE DESCRIPTION

DE Package

14-Lead (4mm × 3mm) Plastic DFN

(Reference LTC DWG # 05-08-1708 Rev B)

0.70 0.05

3.30 0.05

1.70 0.05

3.60 0.05

2.20 0.05

PACKAGE

OUTLINE

0.25 0.05

0.50 BSC

3.00 REF

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

R = 0.115

TYP

0.40 0.10

4.00 0.10

(2 SIDES)

R = 0.05

TYP

3.30 0.10

3.00 0.10

(2 SIDES)

1.70 0.10

PIN 1 NOTCH

R = 0.20 OR

PIN 1

TOP MARK

(SEE NOTE 6)

0.35 × 45°

CHAMFER

(DE14) DFN 0806 REV B

0.25 0.05

0.50 BSC

0.75 0.05

0.200 REF

3.00 REF

0.00 – 0.05

BOTTOM VIEW—EXPOSED PAD

NOTE:

1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WGED-3) IN JEDEC

PACKAGE OUTLINE MO-229

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE

TOP AND BOTTOM OF PACKAGE

2636f

1...19 20 212223 24

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与LTC2636HMS-LMI12相关器件

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LTC2636HMS-LMX8	Linear	Octal 12-/10-/8-Bit SPI VOUT DACs with10ppm/°	获取价格
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