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LT1769

更新时间： 2023-12-20 18:44:01
品牌 Logo 应用领域
亚德诺 - ADI 电池
页数 文件大小 规格书
16页 237K
描述
具输入电流限制功能的恒定电流 / 恒定电压 2A 电池充电器

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LT1769 数据手册

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LT1769  
W W  
U W  
(Note 1)  
ABSOLUTE MAXIMUM RATINGS  
Supply Voltage  
Operating Ambient Temperature  
(VCC, CLP and CLN Pin Voltage)......................... 30V  
BOOST Pin Voltage with Respect to VCC ................. 25V  
IBAT (Average)........................................................... 2A  
Operating Junction Temperature Range  
Commercial ............................................ 0°C to 70°C  
Industrial ........................................... –40°C to 85°C  
Storage Temperature Range ................. –65°C to 150°C  
Lead Temperature (Soldering, 10 sec).................. 300°C  
Commercial ........................................... 0°C to 125°C  
Industrial ......................................... –40°C to 125°C  
U
W U  
PACKAGE/ORDER INFORMATION  
ORDER PART  
ORDER PART  
TOP VIEW  
TOP VIEW  
NUMBER  
NUMBER  
1
2
GND**  
GND**  
GND**  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
GND**  
GND**  
GND**  
SW  
SW  
BOOST  
UV  
1
2
3
4
5
6
7
8
9
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
GND  
LT1769CGN  
LT1769IGN  
LT1769CFE  
LT1769IFE  
V
CC1  
3
V
CC2  
4
V
CC1  
V
CC2  
V
CC3  
*
*
*
GND  
V
CC3  
5
BOOST  
UV  
GND  
PROG  
6
OVP  
V
C
7
GND**  
PROG  
GND**  
GND**  
OVP  
*ALL V PINS SHOULD  
CC  
CLN  
GND  
8
BE CONNECTED  
TOGETHER CLOSE TO  
THE PINS  
CLP  
UV  
OUT  
9
V
C
COMP1  
BAT  
** ALL GND PINS ARE  
FUSED TO INTERNAL DIE  
ATTACH PADDLE FOR  
HEAT SINKING. CONNECT  
THESE PINS TO  
EXPANDED PC LANDS  
FOR PROPER HEAT  
SINKING. 35°C/W  
THERMAL RESISTANCE  
ASSUMES AN INTERNAL  
GROUND PLANE  
DOUBLING AS A HEAT  
SPREADER  
10  
11  
12  
13  
14  
UV  
OUT  
CLP  
SENSE 10  
SPIN  
COMP2  
BAT  
CLN  
COMP1  
SENSE  
GND**  
FE PACKAGE  
20-LEAD PLASTIC TSSOP  
TJMAX = 125°C, θJA = 35°C/ W†  
†THE BOTTOM METAL  
PLATE OF THIS PACKAGE  
IS FUSED TO INTERNAL  
GROUND AND IS FOR  
HEAT SINKING. SOLDER  
THE BOTTOM METAL  
PLATE ONTO PCB  
SPIN  
GND**  
EXPOSED PAD IS GROUND  
(MUST BE SOLDERED TO PCB)  
GN PACKAGE  
28-LEAD PLASTIC SSOP  
3.0  
4.1  
×
EXPOSED PAD SIZE:  
(.188) (.162)  
GROUND PLANE FOR  
HEAT SINKING.  
TJMAX = 125°C, θJA = 35°C/ W**  
Consult LTC Marketing for parts specified with wider operating temperature ranges.  
ELECTRICAL CHARACTERISTICS The ● denotes specifications which apply over the full operating  
temperature range, otherwise specifications are at TA = 25°C. VCC = 16V, VBAT = 8V, RS2 = RS3 = 200Ω (see Block Diagram),  
VCLN = VCC. No load on any outputs unless otherwise noted.  
PARAMETER  
Overall  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
Supply Current  
V
V
= 2.7V, V ≤ 20V  
●
●
4.5  
4.6  
6.8  
7.0  
mA  
mA  
PROG  
PROG  
CC  
= 2.7V, 20V < V ≤ 25V  
CC  
Sense Amplifier CA1 Gain and Input Offset Voltage  
8V ≤ V ≤ 25V , 0V ≤ V  
≤ 20V  
CC  
BAT  
(With R = 200Ω, R = 200Ω)  
R
R
= 4.93k  
= 49.3k  
●
●
93  
8
100  
10  
107  
12  
mV  
mV  
mV  
S2  
S3  
PROG  
PROG  
(Measured across R )(Note 2)  
S1  
T < 0°C  
7
13  
A
V
= 28V, V  
= 20V  
CC  
BAT  
R
= 4.93k  
= 49.3k  
●
●
90  
7
6
110  
13  
14  
mV  
mV  
mV  
PROG  
PROG  
R
T < 0°C  
A
1769fa  
2
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