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LQM2HPNR24MGH# PDF预览

LQM2HPNR24MGH#

更新时间: 2023-09-03 20:31:29
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LQM2HPNR24MGH# 数据手册

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Spec No.: JELF243B_0038R-01  
P6/9  
12. Precautions for Use  
This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other  
mounting method, for example, using a conductive adhesive, please consult us beforehand.  
12.1 Land dimensions  
The following diagram shows the recommended land dimensions for soldering:  
Pattern thickness and  
dimension d  
Chip coil  
Applied  
current (A)  
a
b
c
18 μm 35 μm 70 μm  
0 to 1.5  
1.5 to 2.6  
2.6 to 3.3  
3.3 to 4.2  
1.6  
1.6  
1.6  
1.6  
3.0  
3.0  
3.0  
3.0  
1.5  
1.5  
1.5  
1.5  
1.5  
2.4  
3.6  
4.4  
1.5  
1.5  
2.4  
3.6  
1.5  
1.5  
1.5  
2.4  
c
d
a
b
(in mm)  
Solder Resist  
Pattern  
12.2 Flux and solder used  
Flux  
• Use a rosin-based flux.  
• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).  
• Do not use a water-soluble flux.  
Solder  
• Use Sn-3.0Ag-0.5Cu solder.  
• Standard thickness of solder paste: 100 μm to 150 μm  
If you want to use a flux other than the above, please consult our technical department.  
12.3 Soldering conditions (reflow)  
• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to  
150°C max.  
Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.  
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.  
• Standard soldering profile and the limit soldering profile is as follows.  
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of  
product quality.  
Temp.  
(℃)  
260℃  
230℃  
Limit Profile  
245℃±3℃  
220℃  
180  
150  
Standard Profile  
30s~60s  
60s max.  
90s±30s  
Time.(s)  
Standard profile  
Limit profile  
Pre-heating  
150°C to 180°C/90 s±30 s  
Above 220°C/30 s to 60 s  
245°C±3°C  
150°C to 180°C/90 s±30 s  
Above 230°C/60 s max.  
260°C/10 s  
Heating  
Peak temperature  
Number of reflow cycles  
2 times  
2 times  
MURATA MFG CO., LTD