Spec No.: JELF243B_0038R-01
P6/9
12. Precautions for Use
This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other
mounting method, for example, using a conductive adhesive, please consult us beforehand.
12.1 Land dimensions
The following diagram shows the recommended land dimensions for soldering:
Pattern thickness and
dimension d
Chip coil
Chip Ferrite Bead
Applied
current (A)
a
b
c
18 μm 35 μm 70 μm
0 to 1.5
1.5 to 2.6
2.6 to 3.3
3.3 to 4.2
1.6
1.6
1.6
1.6
3.0
3.0
3.0
3.0
1.5
1.5
1.5
1.5
1.5
2.4
3.6
4.4
1.5
1.5
2.4
3.6
1.5
1.5
1.5
2.4
c
d
a
b
(in mm)
Solder Resist
Pattern
12.2 Flux and solder used
Flux
• Use a rosin-based flux.
• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).
• Do not use a water-soluble flux.
Solder
• Use Sn-3.0Ag-0.5Cu solder.
• Standard thickness of solder paste: 100 μm to 150 μm
If you want to use a flux other than the above, please consult our technical department.
12.3 Soldering conditions (reflow)
• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to
150°C max.
Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
• Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of
product quality.
Temp.
(℃)
260℃
230℃
Limit Profile
245℃±3℃
220℃
180
150
Standard Profile
30s~60s
60s max.
90s±30s
Time.(s)
Standard profile
Limit profile
Pre-heating
150°C to 180°C/90 s±30 s
Above 220°C/30 s to 60 s
245°C±3°C
150°C to 180°C/90 s±30 s
Above 230°C/60 s max.
260°C/10 s
Heating
Peak temperature
Number of reflow cycles
2 times
2 times
MURATA MFG CO., LTD