Datasheet > LQM2HPN3R3MG0#

LQM2HPN3R3MG0#

更新时间： 2023-09-03 20:30:16

品牌	Logo	应用领域
村田 - MURATA		/
页数	文件大小	规格书
9页	434K
描述

阅读下载

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

LQM2HPN3R3MG0# 数据手册

Spec No.: JELF243B_0019P-01

P7/9

12.4 Reworking with soldering iron

The following requirements must be met to rework a soldered product using a soldering iron.

Item

Requirement

150°C/approx. 1 min

350°C max.

Pre-heating

Tip temperature of soldering iron

Power consumption of soldering iron

Tip diameter of soldering iron

Soldering time

80 W max.

ø3 mm max.

3 s (+1 s, -0 s)

2 times max.

Number of reworking operations

* Avoid a direct contact of the tip of the soldering iron with the product. Such a

direction contact may cause cracks in the ceramic body due to thermal shock.

12.5 Solder volume

Solder shall be used not to be exceeded the upper limits as shown below.

An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of

mechanical or electrical performance.

12.6 Product's location

The following shall be considered when designing and laying out PCBs.

(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.

[Products direction]

Products shall be located in the sideways direction (length: a < b) to the mechanical stress.

Poor example

〈

〉

Good example

〈

〉

(2) Components location on PCB separation

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures as possible to reduce

stress.

Contents of measures

Stress level

A > D^*1

A > B

(1) Turn the mounting direction of the component parallel to the

board separation surface.

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away from the

board separation surface.

A > C

*1 A > D is valid when stress is added vertically to the perforation as with hand separation.

If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.

MURATA MFG CO., LTD

1...4 5 678 9

下载PDF

与LQM2HPN3R3MG0#相关器件

型号	品牌	描述	获取价格	数据表
LQM2HPN3R3MGC#	MURATA		获取价格
LQM2HPN3R3MGCB	MURATA	General Purpose Inductor, 3.3uH, 20%, 1 Element, Ferrite-Core, SMD, 1008, CHIP, 1008	获取价格
LQM2HPN3R3MGCL	MURATA	Chip Inductor (Chip Coil) Power Inductor (Multilayer Type)	获取价格
LQM2HPN3R3MGS#	MURATA		获取价格
LQM2HPN3R3MJ0	MURATA	DESIGN ENGINEERING KITS	获取价格
LQM2HPN3R3MJ0#	MURATA		获取价格