Datasheet > LQM18NNR82K00#

LQM18NNR82K00#

更新时间： 2023-09-03 20:28:21

品牌	Logo	应用领域
村田 - MURATA		/
页数	文件大小	规格书
9页	152K
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LQM18NNR82K00# 数据手册

Reference Only

Spec No. JELF243B-0003S-01

P.5/10

9.7 Marking for Outside package (corrugated paper box)

Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS

Marking (2), Quantity, etc ･･･

9.8. Specification of Outer Case

Outer Case Dimensions

Standard Reel Quantity

(mm)

Label

in Outer Case (Reel)

186



Above Outer Case size is typical. It depends on a quantity of an order.

10. ！ Caution

Limitation of Applications

Please contact us before using our products for the applications listed below which require especially

high reliability for the prevention of defects which might directly cause damage to the third party's life,

body or property.

(1) Aircraft equipment

(2) Aerospace equipment

(3) Undersea equipment

(6) Transportation equipment (vehicles, trains, ships, etc.)

(7) Traffic signal equipment

(8) Disaster prevention / crime prevention equipment

(4) Power plant control equipment (9) Data-processing equipment

(5) Medical equipment

(10) Applications of similar complexity and /or reliability

requirements to the applications listed in the above

11. Notice

This product is designed for solder mounting.

Please consult us in advance for applying other mounting method such as conductive adhesive.

11.1 Land pattern designing

Chip Coil

Land

Solder Resist

Soldering

Flow

Reflow

2.2 to 2.6

1.8 to 2.0

0.7

(in mm)

11.2 Flux, Solder

・ Use rosin-based flux.

Don’t use highly acidic flux with halide content exceeding 0.2(wt) % (chlorine conversion value).

Don’t use water-soluble flux.

・ Use Sn-3.0Ag-0.5Cu solder.

・ Standard thickness of solder paste:100μm to 150μm.

11.3 Flow soldering / Reflow soldering conditions

・Pre-heating should be in such a way that the temperature difference between solder and product

surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the

temperature difference is limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products

quality.

・Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the

deterioration of product quality.

MURATA MFG.CO., LTD

1 2 3 456 7 8 9

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