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LQH66SN330M03# PDF预览

LQH66SN330M03#

更新时间: 2023-09-03 20:28:06
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村田 - MURATA /
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LQH66SN330M03# 数据手册

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SpecNo.JELF243A-0047W-01  
P6/8  
Reference Onl  
11.2 Flux, Solder  
Use rosin-based flux.  
Flux  
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).  
Don’t use water-soluble flux.  
Use Sn-3.0Ag-0.5Cu solder  
Standard thickness of solder paste : 200μm to 300μm  
Solder  
Other flux (except above) Please contact us for details, then use.  
11.3 soldering conditions (Reflow)  
Pre-heating should be in such a way that the temperature difference between solder and product surface is limited  
to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is  
limited to 100°C max.  
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.  
Standard soldering profile and the limit soldering profile is as follows.  
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting  
in the deterioration of product quality.  
Temp.  
(℃)  
260℃  
230℃  
Limit Profile  
245℃±3℃  
220℃  
180  
150  
Standard Profile  
30s~60s  
60s max.  
90s±30s  
Time.(s)  
Standard Profile  
Limit Profile  
Pre-heating  
150180°C 90s±30s  
Heating  
above 220°C30s60s  
245±3°C  
above 230°C60s max.  
260°C, 10s  
Peak temperature  
Cycle of reflow  
2 times  
1 time  
11.4 Reworking with soldering iron.  
The following conditions must be strictly followed when using a soldering iron.  
Pre-heating  
150°C,1 min  
350°C max.  
80W max.  
φ3mm max.  
3(+1,-0)s  
Tip temperature  
Soldering iron output  
Tip diameter  
Soldering time  
Times  
2 times  
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products  
due to the thermal shock.  
11.5 Solder Volume  
Solder shall be used not to be exceeded the upper limits as shown below.  
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.  
Exceeding solder volume may cause the failure of mechanical or electrical performance.  
Upper Limit  
Recommendable  
1/3TtT  
(T: Lower flange thickness)  
T t  
MURATA MFG.CO., LTD  

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