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LQH44PN3R3MP0# PDF预览

LQH44PN3R3MP0#

更新时间: 2023-09-03 20:28:21
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村田 - MURATA /
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LQH44PN3R3MP0# 数据手册

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Spec No.: JELF243A_0069R-01  
P6/9  
11.  
Caution  
11.1 Restricted applications  
Restricted  
Please contact us before using our products for the applications listed below which require especially high  
applications reliability for the prevention of defects which might directly cause damage to the third party's life, body or  
property.  
(1) Aircraft equipment  
(6) Transportation equipment (vehicles, trains, ships, etc.)  
(7) Traffic signal equipment  
(2) Aerospace equipment  
(3) Undersea equipment  
(4) Power plant control equipment  
(5) Medical equipment  
(8) Disaster/crime prevention equipment  
(9) Data-processing equipment  
(10) Applications of similar complexity and/or reliability requirements  
to the applications listed in the above  
11.2 Corrosive gas  
Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide,  
etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated  
corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of  
product electrode, etc. We will not bear any responsibility for use under these environments.  
12. Precautions for Use  
This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other  
mounting method, for example, using a conductive adhesive, please consult us beforehand.  
12.1 Land dimensions  
The following diagram shows the recommended land dimensions for reflow soldering.  
The land dimensions are designed in consideration of electrical characteristics and mountability. Use of other land  
dimensions may preclude achievement of performance. In some cases, it may result in poor solderability, including positional  
shift. If you use other land pattern, consider it adequately.  
(in mm)  
12.2 Flux and solder used  
Flux  
• Use a rosin-based flux.  
• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).  
• Do not use a water-soluble flux.  
Solder  
• Use Sn-3.0Ag-0.5Cu solder.  
• Standard thickness of solder paste: 100 μm to 150 μm  
If you want to use a flux other than the above, please consult our technical department.  
MURATA MFG CO., LTD  

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