5秒后页面跳转
捷配首页

Datasheet > LQH44PH100MPR#
LQH44PH100MPR# PDF预览

LQH44PH100MPR#

更新时间： 2023-09-03 20:28:13
品牌 Logo 应用领域
村田 - MURATA /
页数 文件大小 规格书
9页 424K
描述

阅读下载

获取价格

LQH44PH100MPR# 数据手册

 浏览型号LQH44PH100MPR#的Datasheet PDF文件第3页浏览型号LQH44PH100MPR#的Datasheet PDF文件第4页浏览型号LQH44PH100MPR#的Datasheet PDF文件第5页浏览型号LQH44PH100MPR#的Datasheet PDF文件第6页浏览型号LQH44PH100MPR#的Datasheet PDF文件第8页浏览型号LQH44PH100MPR#的Datasheet PDF文件第9页 
Spec No.: JELF243A_9153C-01  
P7/9  
11.3 Soldering conditions (reflow)  
• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to  
100°C max.  
Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.  
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.  
• Standard soldering profile and the limit soldering profile is as follows.  
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of  
product quality.  
Temp.  
(℃)  
260℃  
230℃  
Limit Profile  
245℃±3℃  
220℃  
180  
150  
Standard Profile  
30s～60s  
60s max.  
90s±30s  
Time.(s)  
Standard profile  
Limit profile  
Pre-heating  
150°C to 180°C/90 s±30 s  
Above 220°C/30 s to 60 s  
245°C±3°C  
150°C to 180°C/90 s±30 s  
Above 230°C/60 s max.  
260°C/10 s  
Heating  
Peak temperature  
Number of reflow cycles  
2 times  
2 times  
11.4 Reworking with soldering iron  
The following requirements must be met to rework a soldered product using a soldering iron.  
Item  
Requirement  
150°C/approx. 1 min  
380°C max.  
Pre-heating  
Tip temperature of soldering iron  
Power consumption of soldering iron  
Tip diameter of soldering iron  
Soldering time  
80 W max.  
ø3 mm max.  
3 s (+1 s, -0 s)  
2 times max.  
Number of reworking operations  
* Avoid a direct contact of the tip of the soldering iron with the product. Such a  
direction contact may cause cracks in the ceramic body due to thermal shock.  
11.5 Solder volume  
Solder shall be used not to increase the volume too much.  
An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of  
mechanical or electrical performance.  
MURATA MFG CO., LTD  
1...456789

下载PDF

与LQH44PH100MPR#相关器件

型号 品牌 描述 获取价格 数据表
LQH44PH101MPR# MURATA

获取价格
LQH44PH150MPR# MURATA

获取价格
LQH44PH151MPR# MURATA

获取价格
LQH44PH1R0MPR# MURATA

获取价格
LQH44PH220MPR# MURATA

获取价格
LQH44PH221MPR# MURATA

获取价格

与LQH44PH100MPR#相关文章

您还可以找


热门产品
PCB打样/小批量
铝基板
BOM智能配单
PCBA制造
钣金
精密CNC
模具注塑
薄膜开关
精选活动
PCBA打样特惠
四六层板品质升级
铝基板品质升级
一体化电子制造
DFM下载
服务支持
企业认证
产品展示
工厂展示
工艺能力
积分商城
关于捷配
捷配简介
企业文化
公司动态
人才招聘
联系我们
帮助中心
下单流程
付款流程
开票流程
常见问题
全球PCB制造服务专线 400-613-0088

工作时间：9:00-21:00

CEO邮箱：ceo@jiepei.com

投诉邮箱：tousu@jiepei.com

捷配网-微信公众号 微信公众号
捷配网-微信公众号 抖音公众号
资质认证：
合作快递：
支付方式：
Copyright © 2024 Jiepei.com Inc. All Rights Reserved. 版权所有:杭州捷配信息科技有限公司 浙公网安备 33010502006866号 浙ICP备10014259号-119 营业执照ICP证