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LQH43MN390J03# PDF预览

LQH43MN390J03#

更新时间: 2023-09-03 20:28:23
品牌 Logo 应用领域
村田 - MURATA /
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10页 319K
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LQH43MN390J03# 数据手册

 浏览型号LQH43MN390J03#的Datasheet PDF文件第1页浏览型号LQH43MN390J03#的Datasheet PDF文件第2页浏览型号LQH43MN390J03#的Datasheet PDF文件第3页浏览型号LQH43MN390J03#的Datasheet PDF文件第5页浏览型号LQH43MN390J03#的Datasheet PDF文件第6页浏览型号LQH43MN390J03#的Datasheet PDF文件第7页 
SpecNo.JELF243A-0164B-01  
P4/10  
7. Mechanical Performance  
No.  
Item  
Specification  
Test Method  
7.1 Shear Test  
Chip coil shall not be damaged.  
SubstrateGlass-epoxy substrate  
Applied Direction:  
Chip Coil  
F
Substrate  
Force20N  
Hold Duration5±1 s  
7.2 Bending Test  
SubstrateGlass-epoxy substrate  
(100 40 1.6mm)  
Speed of Applying Force1mm / s  
Deflection2mm  
Hold Duration30 s  
Pressure jig  
R340  
F
Deflection  
Product  
45  
45  
(in mm)  
7.3 Vibration  
Oscillation Frequency:  
10 to 55 to 10Hz for 1 minute  
Total Amplitude1.5mm  
Testing Time:  
A period of 2 hours in each of 3 mutually  
perpendicular directions. (Total 6 hours)  
7.4 Solderability  
The wetting area of the electrode  
shall be at least 90% covered with  
new solder coating.  
FluxEthanol solution of rosin, 25(wt)%  
(Immersed for 5s to 10s)  
SolderSn-3.0Ag-0.5Cu  
Pre-Heating150±10°C / 60 to 90seconds  
Solder Temperature240±5°C  
Immersion Time3±1 s  
7.5 Resistance to  
Soldering Heat  
AppearanceNo damage  
Inductance Changewithin ± 5%  
FluxEthanol solution of rosin, 25(wt)%  
(Immersed for 5s to 10s)  
SolderSn-3.0Ag-0.5Cu  
Pre-Heating150±10°C / 60 to 90seconds  
Solder Temperature270±5°C  
Immersion Time10±1 s  
Then measured after exposure in the room  
condition for 24±2 hours.  
MURATA MFG.CO., LTD  

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