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LQH43MN1R2M03# PDF预览

LQH43MN1R2M03#

更新时间: 2023-09-03 20:28:23
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村田 - MURATA /
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LQH43MN1R2M03# 数据手册

 浏览型号LQH43MN1R2M03#的Datasheet PDF文件第4页浏览型号LQH43MN1R2M03#的Datasheet PDF文件第5页浏览型号LQH43MN1R2M03#的Datasheet PDF文件第6页浏览型号LQH43MN1R2M03#的Datasheet PDF文件第8页浏览型号LQH43MN1R2M03#的Datasheet PDF文件第9页浏览型号LQH43MN1R2M03#的Datasheet PDF文件第10页 
SpecNo.JELF243A-0164B-01  
P7/10  
10.  
Caution  
10.1 Limitation of Applications  
Please contact us before using our products for the applications listed below which require especially high reliability  
for the prevention of defects which might directly cause damage to the third party's life, body or property.  
(1) Aircraft equipment  
(6) Transportation equipment (vehicles, trains, ships, etc.)  
(7) Traffic signal equipment  
(8) Disaster prevention / crime prevention equipment  
(9) Data-processing equipment  
(10) Applications of similar complexity and /or reliability requirements  
to the applications listed in the above  
(2) Aerospace equipment  
(3) Undersea equipment  
(4) Power plant control equipment  
(5) Medical equipment  
10.2 Corrosive gas  
Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide,  
etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated  
corrosive gas environment will result in deterioration of product quality or an open from deterioration due  
11. Notice  
This product is designed for solder mounting.  
Please consult us in advance for applying other mounting method such as conductive adhesive.  
11.1 Land pattern designing  
Recommended land patterns for reflow soldering are as follows:  
These have been designed for Electric characteristics and solderability.  
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or  
solderability may be affected, or result to "position shift" in soldering process.  
Reflow Soldering  
7.5  
1.5 1.5 1.5  
(in mm)  
11.2 Flux, Solder  
Use rosin-based flux.  
Flux  
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).  
Don’t use water-soluble flux.  
Use Sn-3.0Ag-0.5Cu solder  
Standard thickness of solder paste : 200μm to 300μm  
Solder  
Other flux (except above) Please contact us for details, then use.  
MURATA MFG.CO., LTD  

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