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LQH43CN6R8M03# PDF预览

LQH43CN6R8M03#

更新时间: 2023-09-03 20:28:21
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村田 - MURATA /
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9页 253K
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SpecNo.JELF243A-0042R-01  
P7/9  
11.4 Reworking with soldering iron.  
The following conditions must be strictly followed when using a soldering iron.  
Pre-heating  
150°C,1 min  
350°C max.  
80W max.  
3mm max.  
3(+1,-0)s  
Tip temperature  
Soldering iron output  
Tip diameter  
Soldering time  
Times  
2 times  
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack  
on the products due to the thermal shock.  
11.5 Solder Volume  
Solder shall be used not to be exceeded the upper limits as shown below.  
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.  
Exceeding solder volume may cause the failure of mechanical or electrical performance.  
Upper Limit  
Recommendable  
T
t
1/3TtT  
(T: Lower flange thickness)  
11.6 Product's location  
The following shall be considered when designing and laying out P.C.B.'s.  
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.  
Products direction]  
Electrode  
Products shall be locatedin the sideways  
direction (Length:a b) to the mechanical stress.  
(Good example)  
Poor example)  
Electrode  
(2) Components location on P.C.B. separation.  
It is effective to implement the following measures, to reduce stress in separating the board.  
It is best to implement all of the following three measures; however, implement as many measures  
as possible to reduce stress.  
Contents of Measures  
Stress Level  
(1) Turn the mounting direction of the component parallel to  
the board separation surface.  
A
A
A
>
>
>
D 1  
B
(2) Add slits in the board separation part.  
(3) Keep the mounting position of the component away from  
the board separation surface.  
C
C
Seam  
1 A > D is valid when stress is added vertically to  
the perforation as with Hand Separation.  
If a Cutting Disc is used, stress will be diagonal to  
the PCB, therefore A > D is invalid.  
B
Electrode  
Electrode  
D
A
Slit  
(3) Mounting Components Near Screw Holes  
When a component is mounted near a screw hole,  
it may be affected by the board deflection that occurs  
during the tightening of the screw. Mount the component  
in a position as far away from the screw holes as possible.  
Recommended  
Screw Hole  
MURATA MFG.CO., LTD  

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