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LQH43CN470K03# PDF预览

LQH43CN470K03#

更新时间: 2023-09-03 20:28:21
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村田 - MURATA /
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LQH43CN470K03# 数据手册

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SpecNo.JELF243A-0042R-01  
P6/9  
11.3 Flow soldering conditions / Reflow soldering conditions  
Pre-heating should be in such a way that the temperature difference between solder and product surface  
is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the  
temperature difference is limited to 100°C max.  
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.  
Standard soldering profile and the limit soldering profile is as follows.  
The excessive limit soldering conditions may cause leaching of the electrode and / or resultingin the  
deterioration of product quality.  
soldering profile  
(1)Flow soldering profile  
Temp.  
(℃)  
265℃±3℃  
250℃  
Limit Profile  
150  
Heating Time  
Standard Profile  
60s min.  
Time.(s)  
Standard Profile  
Limit Profile  
Pre-heating  
150°C60s min.  
250°C4s6s  
2 times  
265°C±3°C5s  
Heating  
Cycle of flow  
1 time  
(2)Reflow soldering profile  
Temp.  
(℃)  
260℃  
230℃  
245℃±3℃  
220℃  
Limit Profile  
180  
150  
Standard Profile  
30s~60s  
60s max.  
90s±30s  
Time.(s)  
Standard Profile  
Limit Profile  
Pre-heating  
150180°C 90s±30s  
above 220°C30s60s above 230°C60s max.  
Heating  
Peak temperature  
Cycle of reflow  
245±3°C  
260°C,10s  
1 time  
2 times  
MURATA MFG.CO., LTD  

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