Datasheet > LQH43CN101K03#

LQH43CN101K03#

更新时间： 2023-09-03 20:28:21

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村田 - MURATA		/
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LQH43CN101K03# 数据手册

SpecNo.JELF243A-0042R-01

P5/9

10.

Caution

10.1 Limitation of Applications

Please contact us before using our products for the applications listed below which require especially high reliability

for the prevention of defects which might directly cause damage to the third party's life, body or property.

(1) Aircraft equipment

(2) Aerospace equipment

(3)Undersea equipment

(7) Traffic signal equipment

(8) Disaster prevention / crime prevention equipment

(9) Data-processing equipment

(4)Power plant control equipment (10) Applications of similar complexity and /or reliability requirements

(5) Medical equipment to the applications listed in the above

(6) Transportation equipment (vehicles, trains, ships, etc.)

10.2 Corrosive gas

Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur

dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously

stated corrosive gas environment will result in deterioration of product quality or an open from deterioration due to

corrosion of product electrode, etc. We will not bear any responsibility for use under these environments.

11. Notice

This product is designed for solder mounting.

Please consult us in advance for applying other mounting method such as conductive adhesive.

11.1 Land pattern designing

Recommended land patterns for flow and reflow soldering are as follows:

These have been designed for Electric characteristics and solderability.

Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or

solderability may be affected, or result to "position shift" in soldering process.

Flow Soldering

Reflow Soldering *

7.5

Chip Coil

Land

Solder Resist

1.5 1.5 1.5

1.5

(in mm)

* Applicable to flow soldering.

11.2 Flux, Solder

・Use rosin-based flux.

・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion

Flux

value).

・ Don’t use water-soluble flux.

・Use Sn-3.0Ag-0.5Cu solder

・Standard thickness of solder paste : 200μm to 300μm

Solder

Other flux (except above) Please contact us for details, then use.

MURATA MFG.CO., LTD

1 2 3 456 7 8 9

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