Spec No.: JELF243A_0114N-01
No. Item
P3/10
Specification
Test method
8.2 Bending test
No significant mechanical damage or no Test substrate: glass-epoxy substrate (100 mm × 40
sign of electrode peeling off shall be
observed.
mm × 1.0 mm)
Pressurizing speed: 0.5 mm/s
Deflection: 2 mm
Holding time: 5 s
8.3 Vibration
Appearance shall have no significant
mechanical damage.
Oscillation frequency: 10 Hz to 2000 Hz to 10 Hz, for
approx. 20 min
Total amplitude: total amplitude of 1.5 mm or
acceleration amplitude of 98 m/s2, whichever is smaller
Test time: 3 directions perpendicular to each other, 2 h
for each direction (6 h in total)
8.4 Solderability
90% or more of the outer electrode shall Flux: immersed in ethanol solution with a rosin content
be covered with new solder seamlessly. of 25(wt)% for 5 s to 10 s
Solder: Sn-3.0Ag-0.5Cu solder
Pre-heating: 150°C±10°C/60 s to 90 s
Solder temperature: 240°C±5°C
Immersion time: 3 s±1 s
8.5 Resistance to
soldering heat
Appearance: No significant mechanical
damage shall be observed.
Flux: immersed in ethanol solution with a rosin content
of 25(wt)% for 5 s to 10 s
Inductance change rate: within ±10%
Solder: Sn-3.0Ag-0.5Cu solder
Pre-heating: 150°C±10°C/60 s to 90 s
Solder temperature: 270°C±5°C
Immersion time: 10 s±1 s
Post-treatment: left at a room condition for 24 h±2 h
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