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LQH32NZ820J23# PDF预览

LQH32NZ820J23#

更新时间: 2023-09-03 20:28:02
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村田 - MURATA /
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LQH32NZ820J23# 数据手册

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Reference Only  
SpecNo.JELF243A-9144C-01  
P6/8  
10. Notice  
This product is designed for solder mounting. (Reflow soldering only)  
Please consult us in advance for applying other mounting method such as conductive adhesive.  
10.1 Land pattern designing (Reflow Soldering)  
Recommended land pattern for reflow soldering is as follows:  
It has been designed for Electric characteristics and solderability.  
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or  
solderability may be affected, or result to "position shift" in soldering process.  
Reflow Soldering  
Solder Resist  
5.5  
Chip Coil  
(in mm)  
1.0 1.3 1.0  
Land  
10.2 Flux, Solder  
Use rosin-based flux.  
Flux  
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).  
Don’t use water-soluble flux.  
Use Sn-3.0Ag-0.5Cu solder  
Standard thickness of solder paste : 100μm to 150μm  
Solder  
Other flux (except above) Please contact us for details, then use.  
10.3 Reflow soldering conditions  
Pre-heating should be in such a way that the temperature difference between solder and product surface is limited  
to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is  
limited to 100°C max.  
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality.  
Standard soldering profile and the limit soldering profile is as follows.  
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration  
of product quality.  
Reflow soldering profile  
Temp.  
(℃)  
260℃  
230℃  
Limit Profile  
245℃±3℃  
220℃  
180  
150  
Standard Profile  
30s~60s  
60s max.  
90s±30s  
Time.(s)  
Standard Profile  
150180°C 90s±30s  
above 220°C30s60s above 230°C60s max.  
Limit Profile  
Pre-heating  
Heating  
Peak temperature  
Cycle of reflow  
245±3°C  
2 times  
260°C,10s  
2time  
MURATA MFG.CO., LTD  

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