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LQH2HPN6R8MGR# PDF预览

LQH2HPN6R8MGR#

更新时间: 2023-09-03 20:28:15
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村田 - MURATA /
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9页 402K
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LQH2HPN6R8MGR# 数据手册

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Spec No.: JELF243A_0103S-01  
P7/9  
12.4 Reworking with soldering iron  
The following requirements must be met to rework a soldered product using a soldering iron.  
Item  
Requirement  
150°C/approx. 1 min  
350°C max.  
Pre-heating  
Tip temperature of soldering iron  
Power consumption of soldering iron  
Tip diameter of soldering iron  
Soldering time  
80 W max.  
ø3 mm max.  
3 s (+1 s, -0 s)  
1 time max.  
Number of reworking operations  
* Avoid a direct contact of the tip of the soldering iron with the product. Such a  
direction contact may cause cracks in the ceramic body due to thermal shock.  
12.5 Solder volume  
Solder shall be used not to increase the volume too much.  
An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of  
mechanical or electrical performance.  
12.6 Product's location  
The following shall be considered when designing and laying out PCBs.  
(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.  
[Products direction]  
Products shall be located in the sideways direction to the mechanical stress.  
Electrode  
(Good example)  
(Poor example)  
Electrode  
(2) Components location on PCB separation  
It is effective to implement the following measures, to reduce stress in separating the board.  
It is best to implement all of the following three measures; however, implement as many measures as possible to reduce  
stress.  
Contents of measures  
Stress level  
A > D*1  
A > B  
(1) Turn the mounting direction of the component parallel to the  
board separation surface.  
(2) Add slits in the board separation part.  
(3) Keep the mounting position of the component away from the  
board separation surface.  
A > C  
*1 A > D is valid when stress is added vertically to the perforation as with hand separation.  
If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.  
C
Perforation  
B
Electrode  
D
A
Slit  
Electrode  
(3) Mounting components near screw holes  
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the  
tightening of the screw.  
Mount the component in a position as far away from the screw holes as possible.  
MURATA MFG CO., LTD  

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