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LQB18NNR27N10# PDF预览

LQB18NNR27N10#

更新时间: 2023-09-03 20:28:10
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村田 - MURATA /
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LQB18NNR27N10# 数据手册

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Spec. No. JELF243B-0034C-01  
P.6/9  
9. Caution  
9-1. Limitation of Applications  
Limitation of Applications  
Please contact us before using our products for the applications listed below which require especially high  
reliability for the prevention of defects which might directly cause damage to the third party's life, body or  
property.  
(1) Aircraft equipment  
(2) Aerospace equipment  
(3) Undersea equipment  
(7) Traffic signal equipment  
(8) Disaster prevention / crime prevention equipment  
(9) Data-processing equipment  
(4) Power plant control equipment (10) Applications of similar complexity and /or reliability requirements  
(5) Medical equipment to the applications listed in the above  
(6) Transportation equipment (vehicles, trains, ships, etc.)  
10. Notice  
This product is designed for solder mounting.  
Please consult us in advance for applying other mounting method such as conductive adhesive.  
10-1. Land pattern designing  
Standard land dimensions  
Chip Coil  
Soldering  
Flow  
Reflow  
a
b
c
c
2.2 to 2.6  
1.8 to 2.0  
0.7  
0.7  
a
b
Solder Resist  
Pattern  
(in mm)  
10-2. Soldering Conditions  
Products can be applied to reflow and flow soldering.  
(1) Flux, Solder  
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )  
Do not use water-soluble flux.  
Flux  
Use Sn-3.0Ag-0.5Cu solder  
Standard thickness of solder paste : 100 µm to 200 μm  
Solder  
(2) Soldering conditions  
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is  
limited to 150°C max. Also cooling into solvent after soldering should be in such a way that the temperature  
difference is limited to 100°C max.  
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.  
Standard soldering profile and the limit soldering profile is as follows.  
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the  
deterioration of product quality.  
MURATA MFG.CO., LTD.  

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