Datasheet > LPS27HHTW

LPS27HHTW

更新时间： 2023-12-20 18:44:06

品牌	Logo	应用领域
意法半导体 - STMICROELECTRONICS		/
页数	文件大小	规格书
55页	1385K
描述
MEMS pressure sensor: 260-1260 hPa absolute digital output barometer with embedded temperature sensor in water-resistant package

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LPS27HHTW 数据手册

LPS27HHTW

Datasheet

MEMS pressure sensor: 260-1260 hPa absolute digital output barometer with

embedded temperature sensor in water-resistant package

Features

•

Pressure sensor with water-resistant package

Potting gel and grounded metal cap

260 to 1260 hPa absolute pressure range

Current consumption down to 4 µA

Absolute pressure accuracy: 0.5 hPa

Low pressure sensor noise: 0.7 Pa

Temperature accuracy: ±1.5 °C

Embedded temperature compensation

24-bit pressure data output

ODR from 1 Hz to 200 Hz

•

SPI, I²C or MIPI I3C^SMinterfaces

Embedded FIFO

Interrupt functions: Data-Ready, FIFO flags, pressure thresholds

Supply voltage: 1.7 to 3.6 V

ECOPACK lead-free compliant

Applications

•

Altimeters and barometers for portable devices

GPS applications

Weather station equipment

Sport watches

Product status link

LPS27HHTW

e-cigarettes

Product summary

Water depth monitoring

Gas metering

Order code

LPS27HHTWTR

-40 to +85°C

CCLGA-10L

Temp. range [°C]

Package

Description

The LPS27HHTW is an ultra-compact piezoresistive absolute pressure sensor which

functions as a digital output barometer. The device also embeds a temperature

sensor to monitor ambient temperature. The LPS27HHTW comprises a sensing

element and an IC interface which communicates through I²C, MIPI I3C^SMor SPI

from the sensing element to the application.

Packing

Tape and reel

Product label

The sensing element, which detects absolute pressure, consists of a suspended

membrane manufactured using a dedicated process developed by ST.

The LPS27HHTW is available in a ceramic LGA package with metal lid. It is

guaranteed to operate over a temperature range extending from -40 °C to +85 °C.

The package is holed to allow external pressure to reach the sensing element. Gel

inside the IC protects the electrical components from water and the metal cap is

grounded electrically for better ESD robustness.

DS13489 - Rev 1 - January 2021

For further information contact your local STMicroelectronics sales office.

www.st.com

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