LP5900
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DSBGA
SNVS358O –JULY 2005–REVISED MAY 2013
PIN DESCRIPTIONS (continued)
Pin No.
Symbol
GND
Name and Function
Common Ground. Connect to Pin 3.
WSON
Pad
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
(1)(2)(3)
Absolute Maximum Ratings
VIN Pin: Input Voltage
-0.3 to 6.0V
-0.3 to (VIN + 0.3V) to 6.0V (max)
-0.3 to (VIN + 0.3V) to 6.0V (max)
Internally Limited
VOUT Pin: Output Voltage
VEN Pin: Enable Input Voltage
Continuous Power Dissipation
(4)
Junction Temperature (TJMAX
)
150°C
Storage Temperature Range
-65 to 150°C
Maximum Lead Temperature (Soldering, 10 sec.)
260°C
(5)
ESD Rating
Human Body Model
Machine Model
2 kV
200V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits
and associated test conditions, see the Electrical Characteristics tables.
(2) All voltages are with respect to the potential at the GND pin.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(4) Internal thermal shutdown circuitry protects the device from permanent damage.
(5) The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF
capacitor discharged directly into each pin. MIL-STD-883 3015.7
(1)(2)
Operating Ratings
VIN: Input Voltage Range
2.5V to 5.5V
0 to (VIN + 0.3V) to 5.5V (max)
0 to 150 mA
VEN: Enable Voltage Range
Recommended Load Current
(3)
Junction Temperature Range (TJ)
-40°C to +125°C
-40°C to +85°C
Ambient Temperature Range (TA)
(3)
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits
and associated test conditions, see the Electrical Characteristics tables.
(2) All voltages are with respect to the potential at the GND pin.
(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP
=
125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the
part/package in the application (θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX). See applications section.
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