Datasheet > LP5890RRFR

LP5890RRFR

更新时间： 2023-09-03 20:31:36

品牌	Logo	应用领域
德州仪器 - TI		驱动驱动器
页数	文件大小	规格书
70页	3084K
描述
具有 16 位 PWM 调光和超低功耗的 48x16 LED 矩阵驱动器 \| RRF \| 76 \| -40 to 85

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LP5890RRFR 数据手册

LP5890

ZHCSO29 –JULY 2021

www.ti.com.cn

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

MIN

–0.3

–40

–55

MAX

UNIT

VCC

VR/G/B

Voltage

IREF, SCLK, SIN, SOUT, VSYNC

RX/GX/BX

LINE0 to LINE15

Operating junction temperature, T_J

Storage temperature, T_stg

150

°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

7.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾

±4000

V_(ESD)

Electrostatic discharge

Charged-device model (CDM), per JEDEC specification JESD22-

C101⁽²⁾

±1000

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

2.5

NOM

MAX

5.5

UNIT

VCC

Device supply voltage

VLEDR/G/B LED supply voltage

2.5

5.5

V_IH

V_IL

I_OH

I_OL

I_CH

I_LINE

T_A

High level logic input voltage (SCLK, SIN, VSYNC)

0.7 × VCC

Low level logic input voltage (SCLK, SIN, VSYNC)

High level logic output current (SOUT)

Low level logic output current (SOUT)

Constant output source current

0.3 × VCC

–2

0.2

Line scan switch load current

Ambient operating temperature

°C

–40

7.4 Thermal Information

LP5890

THERMAL METRIC⁽¹⁾

RRF (VQFN)

76 PINS

22.2

ZXL (BGA)

UNIT

96 PINS

33.5

18.6

11.7

R_θJA

Junction-to-ambient thermal resistance

°C/W

R_θJC(top)Junction-to-case (top) thermal resistance

10.7

R_θJB

ψ_JT

Junction-to-board thermal resistance

7.2

Junction-to-top characterization parameter

Junction-to-board characterization parameter

0.1

0.3

7.1

11.6

ψ_JB

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