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LNK3205G-TL PDF预览

LNK3205G-TL

更新时间: 2024-01-23 22:46:35
品牌 Logo 应用领域
帕沃英蒂格盛 - POWERINT 开关光电二极管
页数 文件大小 规格书
22页 1875K
描述
IC OFFLN CONV MULT TOP 8SMD

LNK3205G-TL 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:SOP,
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01Factory Lead Time:14 weeks
风险等级:1.74模拟集成电路 - 其他类型:SWITCHING REGULATOR
JESD-30 代码:R-PDSO-G7长度:9.44 mm
功能数量:1端子数量:7
最高工作温度:125 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED座面最大高度:3.98 mm
表面贴装:YES切换器配置:BUCK-BOOST
温度等级:AUTOMOTIVE端子形式:GULL WING
端子节距:2.54 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:6.35 mm
Base Number Matches:1

LNK3205G-TL 数据手册

 浏览型号LNK3205G-TL的Datasheet PDF文件第15页浏览型号LNK3205G-TL的Datasheet PDF文件第16页浏览型号LNK3205G-TL的Datasheet PDF文件第17页浏览型号LNK3205G-TL的Datasheet PDF文件第19页浏览型号LNK3205G-TL的Datasheet PDF文件第20页浏览型号LNK3205G-TL的Datasheet PDF文件第21页 
LNK3202/3204-6  
PDIP-8C (P Package)  
D S .004 (.10)  
Notes:  
-E-  
1. Package dimensions conform to JEDEC specification  
MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)  
package with .300 inch row spacing.  
2. Controlling dimensions are inches. Millimeter sizes are  
shown in parentheses.  
3. Dimensions shown do not include mold flash or other  
protrusions. Mold flash or protrusions shall not exceed  
.006 (.15) on any side.  
.240 (6.10)  
.260 (6.60)  
4. Pin locations start with Pin 1, and continue counter-clock-  
wise to Pin 8 when viewed from the top. The notch and/or  
dimple are aids in locating Pin 1. Pin 3 is omitted.  
5. Minimum metal to metal spacing at the package body for  
the omitted lead location is .137 inch (3.48 mm).  
6. Lead width measured at package body.  
7. Lead spacing measured with the leads constrained to be  
perpendicular to plane T.  
Pin 1  
-D-  
.356 (9.05)  
.387 (9.83)  
.057 (1.45)  
.068 (1.73)  
(NOTE 6)  
.125 (3.18)  
.145 (3.68)  
.015 (.38)  
MINIMUM  
-T-  
SEATING  
PLANE  
.008 (.20)  
.015 (.38)  
.118 (3.00)  
.140 (3.56)  
.300 (7.62) BSC  
(NOTE 7)  
.100 (2.54) BSC  
.048 (1.22)  
.053 (1.35)  
.137 (3.48)  
MINIMUM  
P08C  
.300 (7.62)  
.390 (9.91)  
.014 (.36)  
.022 (.56)  
T E D S .010 (.25) M  
PI-3933-081716  
SMD-8C (G Package)  
Notes:  
D S .004 (.10)  
.046 .060 .060 .046  
1. Controlling dimensions are  
inches. Millimeter sizes are  
shown in parentheses.  
-E-  
2. Dimensions shown do not  
include mold flash or other  
protrusions. Mold flash or  
protrusions shall not exceed  
.006 (.15) on any side.  
3. Pin locations start with Pin 1,  
and continue counter-clock-  
wise to Pin 8 when viewed  
from the top. Pin 3 is omitted.  
4. Minimum metal to metal  
spacing at the package body  
for the omitted lead location  
is .137 inch (3.48 mm).  
5. Lead width measured at  
package body.  
.080  
.086  
.186  
.286  
.372 (9.45)  
.388 (9.86)  
.010 (.25)  
.240 (6.10)  
.260 (6.60)  
.420  
E S  
Pin 1  
Pin 1  
.137 (3.48)  
MINIMUM  
6. D and E are referenced  
datums on the package  
body.  
Solder Pad Dimensions  
.100 (2.54) (BSC)  
.356 (9.05)  
.387 (9.83)  
-D-  
.057 (1.45)  
.068 (1.73)  
(NOTE 5)  
.125 (3.18)  
.145 (3.68)  
.004 (.10)  
.032 (.81)  
.037 (.94)  
.048 (1.22)  
.053 (1.35)  
°
°
.009 (.23)  
0 - 8  
.036 (0.91)  
.044 (1.12)  
.004 (.10)  
.012 (.30)  
G08C  
PI-4015-081716  
18  
Rev. F 01/17  
www.power.com  

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