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LMS33460MG PDF预览

LMS33460MG

更新时间: 2024-01-03 20:52:51
品牌 Logo 应用领域
德州仪器 - TI 光电二极管
页数 文件大小 规格书
18页 633K
描述
节省空间的超低功耗 3V 欠压检测器 | DCK | 5 | -40 to 85

LMS33460MG 技术参数

生命周期:Not Recommended零件包装代码:SOIC
包装说明:SC-70, 5 PIN针数:5
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.14
Samacsys Confidence:Samacsys Status:Released
Samacsys PartID:589811Samacsys Pin Count:5
Samacsys Part Category:Integrated CircuitSamacsys Package Category:Other
Samacsys Footprint Name:SOT65P210X110-5NSamacsys Released Date:2017-01-11 19:09:53
Is Samacsys:N其他特性:DETECTOR THRESHOLD VOLTAGE IS 3 V
可调阈值:NO模拟集成电路 - 其他类型:POWER SUPPLY SUPPORT CIRCUIT
JESD-30 代码:R-PDSO-G5JESD-609代码:e0
长度:2 mm湿度敏感等级:1
信道数量:1功能数量:1
端子数量:5最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装等效代码:TSSOP5/6,.08
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度):260认证状态:Not Qualified
座面最大高度:1.1 mm子类别:Power Management Circuits
最大供电电流 (Isup):0.2 mA最大供电电压 (Vsup):7 V
最小供电电压 (Vsup):0.7 V标称供电电压 (Vsup):1.1 V
表面贴装:YES温度等级:INDUSTRIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
阈值电压标称:+3V处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:1.25 mmBase Number Matches:1

LMS33460MG 数据手册

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LMS33460  
SNVS158E MARCH 2001REVISED DECEMBER 2016  
www.ti.com  
Table of Contents  
7.4 Device Functional Modes.......................................... 7  
Application and Implementation .......................... 8  
8.1 Application Information.............................................. 8  
8.2 Typical Application .................................................... 8  
Power Supply Recommendations........................ 9  
1
2
3
4
5
6
Features.................................................................. 1  
Applications ........................................................... 1  
Description ............................................................. 1  
Revision History..................................................... 2  
Pin Configuration and Functions......................... 3  
Specifications......................................................... 3  
6.1 Absolute Maximum Ratings ...................................... 3  
6.2 ESD Ratings.............................................................. 3  
6.3 Recommended Operating Conditions....................... 3  
6.4 Thermal Information.................................................. 4  
6.5 Electrical Characteristics........................................... 4  
6.6 Typical Characteristics.............................................. 5  
Detailed Description .............................................. 6  
7.1 Overview ................................................................... 6  
7.2 Functional Block Diagram ......................................... 7  
7.3 Feature Description................................................... 7  
8
9
10 Layout..................................................................... 9  
10.1 Layout Guidelines ................................................... 9  
10.2 Layout Example ...................................................... 9  
11 Device and Documentation Support ................. 10  
11.1 Receiving Notification of Documentation Updates 10  
11.2 Community Resources.......................................... 10  
11.3 Trademarks........................................................... 10  
11.4 Electrostatic Discharge Caution............................ 10  
11.5 Glossary................................................................ 10  
7
12 Mechanical, Packaging, and Orderable  
Information ........................................................... 10  
4 Revision History  
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.  
Changes from Revision D (April 2013) to Revision E  
Page  
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation  
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and  
Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1  
Deleted Ordering Information table; see POA at the end of the data sheet........................................................................... 1  
Added Thermal Information table ........................................................................................................................................... 4  
Changed RθJA value From: 478 To: 275.5.............................................................................................................................. 4  
Changes from Revision C (April 2013) to Revision D  
Page  
Changed layout of National Semiconductor Data Sheet to TI format .................................................................................... 1  
2
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Product Folder Links: LMS33460  
 

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