LMR43620, LMR43610
SNVSBY4 – DECEMBER 2020
www.ti.com
4 Device and Documentation Support
4.1 Documentation Support
4.1.1 Related Documentation
For related documentation see the following:
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Texas Instruments, Thermal Design by Insight not Hindsight Application Report
Texas Instruments, A Guide to Board Layout for Best Thermal Resistance for Exposed Pad Packages
Application Report
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Texas Instruments, Semiconductor and IC Package Thermal Metrics Application Report
Texas Instruments, Thermal Design Made Simple with LM43603 and LM43602 Application Report
Texas Instruments, PowerPAD™ Thermally Enhanced Package Application Report
Texas Instruments, PowerPAD™ Made Easy Application Report
Texas Instruments, Using New Thermal Metrics Application Report
Texas Instruments, Layout Guidelines for Switching Power Supplies Application Report
Texas Instruments, Simple Switcher PCB Layout Guidelines Application Report
Texas Instruments, Construction Your Power Supply- Layout Considerations Seminar
Texas Instruments, Low Radiated EMI Layout Made Simple with LM4360x and LM4600x Application Report
4.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
4.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
4.4 Trademarks
HotRod™, PowerPAD™, and are trademarks of TI.
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
4.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
4.6 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
Copyright © 2020 Texas Instruments Incorporated
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