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LMK107BJ475MK-T

更新时间： 2024-01-11 19:12:23
品牌 Logo 应用领域
太诱 - TAIYO YUDEN 电容器
页数 文件大小 规格书
23页 760K
描述
Ceramic Capacitor, Multilayer, Ceramic, 10V, 20% +Tol, 20% -Tol, X5R, 15% TC, 4.7uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT

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LMK107BJ475MK-T 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active包装说明：CHIP, ROHS COMPLIANT
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8532.24.00.20风险等级：5.63
电容：4.7 µF电容器类型：CERAMIC CAPACITOR
介电材料：CERAMIC高度：0.45 mm
长度：1.6 mm安装特点：SURFACE MOUNT
多层：Yes负容差：20%
端子数量：2最高工作温度：85 °C
最低工作温度：-55 °C封装形状：RECTANGULAR PACKAGE
封装形式：SMT包装方法：TR, PUNCHED PAPER, 7 INCH
正容差：20%额定（直流）电压（URdc）：10 V
系列：MK(HIGH VALUE)尺寸代码：0603
表面贴装：YES温度特性代码：X5R
温度系数：15% ppm/ °C端子形状：WRAPAROUND
宽度：0.8 mmBase Number Matches：1

LMK107BJ475MK-T 数据手册

 浏览型号LMK107BJ475MK-T的Datasheet PDF文件第17页浏览型号LMK107BJ475MK-T的Datasheet PDF文件第18页浏览型号LMK107BJ475MK-T的Datasheet PDF文件第19页浏览型号LMK107BJ475MK-T的Datasheet PDF文件第21页浏览型号LMK107BJ475MK-T的Datasheet PDF文件第22页浏览型号LMK107BJ475MK-T的Datasheet PDF文件第23页 
■ PRECAUTIONS  
Precautions on the use of Multilayer Ceramic Capacitors  
1. Circuit Design  
◆Verification of operating environment, electrical rating and performance  
1.A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have severe social ramifications.  
Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from them used in general pur-  
pose applications.  
◆Operating Voltage（Verification of Rated voltage）  
1.The operating voltage for capacitors must always be their rated voltage or less.  
Precautions  
If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less.  
For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less.  
2.Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC voltage or a pulse voltage  
having rapid rise time is used in a circuit.  
2. PCB Design  
◆Pattern configurations（Design of Land-patterns）  
1. When capacitors are mounted on PCBs, the amount of solder used（size of fillet）can directly affect the capacitor performance. Therefore, the following items must  
be carefully considered in the design of land patterns:  
（1）Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider appropriate land-patterns for proper  
amount of solder.  
Precautions  
（2）When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by solder-resist.  
◆Pattern configuration（s Capacitor layout on PCBs）  
After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes（PCB cutting, board inspection,  
mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.）. For this reason, land pattern configurations and positions of capacitors  
shall be carefully considered to minimize stresses.  
◆Pattern configurations（Design of Land-patterns）  
The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts.  
（1）Recommended land dimensions for typical chip capacitors  
●Multilayer Ceramic Capacitors : Recommended land dimensions（unit: mm）  
ꢁWave-soldering  
Land patterns for PCBs  
Chip capacitor  
Land  
Type 107  
212  
2.0  
316  
3.2  
1.6  
325  
3.2  
2.5  
L
1.6  
0.8  
Solder-resist  
Size  
W
51.25  
A
0.8 to 1.0 1.0 to 1.4 1.8 to 2.5 1.8 to 2.5  
0.5 to 0.8 0.8 to 1.5 0.8 to 1.7 0.8 to 1.7  
0.6 to 0.8 0.9 to 1.2 1.2 to 1.6 1.8 to 2.5  
C
B
C
B
B
A
Reflow-soldering  
Type 042  
063  
0.6  
0.3  
105  
1.0  
0.5  
107  
1.6  
0.8  
212  
2.0  
316  
3.2  
1.6  
325  
3.2  
2.5  
432  
4.5  
3.2  
Chip capacitor  
L
0.4  
0.2  
Size  
W
51.25  
W
A
0.15 to 0.25 0.20 to 0.30 0.45 to 0.55 0.8 to 1.0 0.8 to 1.2 1.8 to 2.5 1.8 to 2.5 2.5 to 3.5  
0.15 to 0.20 0.20 to 0.30 0.40 to 0.50 0.6 to 0.8 0.8 to 1.2 1.0 to 1.5 1.0 to 1.5 1.5 to 1.8  
0.15 to 0.30 0.25 to 0.40 0.45 to 0.55 0.6 to 0.8 0.9 to 1.6 1.2 to 2.0 1.8 to 3.2 2.3 to 3.5  
B
C
L
Note：Recommended land size might be different according to the allowance of the size of the product.  
LWDC  
●LWDC: Recommended land dimensions for reflow-soldering（unit: mm）  
Type  
105  
0.52  
107  
50.8  
212  
1.25  
L
W
Size  
W
1.0  
1.6  
2.0  
A
0.18 to 0.22  
0.2 to 0.25  
0.9 to 1.1  
0.25 to 0.3  
0.3 to 0.4  
1.5 to 1.7  
0.5 to 0.7  
0.4 to 0.5  
1.9 to 2.1  
B
C
L
Technical  
consider-  
ations  
●Array type: Recommended land dimensions for reflow-soldering（unit: mm）  
Type 096（2 circuits）110（2 circuits）212（2 circuits） 212（4 circuits）  
2 circuits  
4 circuits  
Chip capacitor  
L
0.9  
1.37  
2.0  
2.0  
c
c
Size  
W
0.6  
1.0  
1.25  
1.25  
a
b
a
a
b
a
a
0.25 to 0.35  
0.15 to 0.25  
0.15 to 0.25  
0.45  
0.35 to 0.45  
0.55 to 0.65  
0.3 to 0.4  
0.64  
0.5 to 0.6  
0.5 to 0.6  
0.5 to 0.6  
1.0  
0.5 to 0.6  
0.5 to 0.6  
0.2 to 0.3  
0.5  
b
c
d
d
d
Land  
（2）Examples of good and bad solder application  
Items  
Not recommended  
Recommended  
Mixed mounting of  
SMD and leaded  
components  
Component  
placement close to  
the chassis  
Hand-soldering  
of leaded  
components  
near mounted  
components  
Horizontal  
component  
placement  
To next page  
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.  
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.  
mlcc_prec_e-01  
mlcc_prec-P1  
1...17181920212223

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