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LM4990ITL

更新时间： 2024-01-08 03:54:43
品牌 Logo 应用领域
美国国家半导体 - NSC 商用集成电路放大器功率放大器
页数 文件大小 规格书
19页 724K
描述
2 Watt Audio Power Amplifier with Selectable Shutdown Logic Level

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LM4990ITL 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active包装说明：TSSOP, TSSOP10,.19,20
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.33.00.01Factory Lead Time：12 weeks
风险等级：0.85商用集成电路类型：AUDIO AMPLIFIER
JESD-30 代码：S-PDSO-G8JESD-609代码：e3
长度：3 mm湿度敏感等级：1
信道数量：1功能数量：1
端子数量：8最高工作温度：85 °C
最低工作温度：-40 °C标称输出功率：2 W
封装主体材料：PLASTIC/EPOXY封装代码：TSSOP
封装等效代码：TSSOP10,.19,20封装形状：SQUARE
封装形式：SMALL OUTLINE, THIN PROFILE, SHRINK PITCH峰值回流温度（摄氏度）：260
电源：2.6/5 V认证状态：Not Qualified
座面最大高度：1.1 mm子类别：Audio/Video Amplifiers
最大压摆率：10 mA最大供电电压 (Vsup)：5.5 V
最小供电电压 (Vsup)：2.2 V表面贴装：YES
温度等级：INDUSTRIAL端子面层：Matte Tin (Sn)
端子形式：GULL WING端子节距：0.65 mm
端子位置：DUAL处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：3 mmBase Number Matches：1

LM4990ITL 数据手册

 浏览型号LM4990ITL的Datasheet PDF文件第3页浏览型号LM4990ITL的Datasheet PDF文件第4页浏览型号LM4990ITL的Datasheet PDF文件第5页浏览型号LM4990ITL的Datasheet PDF文件第7页浏览型号LM4990ITL的Datasheet PDF文件第8页浏览型号LM4990ITL的Datasheet PDF文件第9页 
Electrical Characteristics VDD = 2.6V (Notes 1, 2)  
The following specifications apply for the circuit shown in Figure 1, unless otherwise specified. Limits apply for TA  
25˚C. (Continued)  
=
Note 13: The Exposed-DAP of the LDA10B package should be electrically connected to GND or an electrically isolated copper area. the LM4990LD demo board  
has the Exposed-DAP connected to GND with a PCB area of 86.7mils x 585mils (2.02mm x 14.86mm) on the copper top layer and 550mils x 710mils (13.97mm  
x 18.03mm) on the copper bottom layer.  
Note 14: The thermal performance of the LLP and exposed-DAP TSSOP packages when used with the exposed-DAP connected to a thermal plane is sufficient for  
driving 4Ω loads. The MSOP and ITL packages do not have the thermal performance necessary for driving 4Ω loads with a 5V supply and is not recommended for  
this application.  
Note 15: All bumps have the same thermal resistance and contribute equally when used to lower thermal resistance. All bumps must be connected to achieve  
specified thermal resistance.  
External Components Description  
See (Figure 1)  
Components  
Functional Description  
1.  
Ri  
Inverting input resistance which sets the closed-loop gain in conjunction with Rf. This resistor also forms a  
high pass filter with Ci at fC= 1/(2π RiCi).  
2.  
Ci  
Input coupling capacitor which blocks the DC voltage at the amplifiers input terminals. Also creates a  
highpass filter with Ri at fc = 1/(2π RiCi). Refer to the section, Proper Selection of External Components,  
for an explanation of how to determine the value of Ci.  
3.  
4.  
Rf  
Feedback resistance which sets the closed-loop gain in conjunction with Ri.  
CS  
Supply bypass capacitor which provides power supply filtering. Refer to the Power Supply Bypassing  
section for information concerning proper placement and selection of the supply bypass capacitor.  
Bypass pin capacitor which provides half-supply filtering. Refer to the section, Proper Selection of External  
Components, for information concerning proper placement and selection of CB.  
5.  
CB  
Typical Performance Characteristics  
LD and MH Specific Characteristics  
THD+N+N vs Frequency  
THD+N+N vs Output Power  
VDD = 5V, RL = 4Ω, and PO = 1W  
VDD = 5V, RL = 4Ω, and f = 1 kHz  
20051030  
20051031  
www.national.com  
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