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LM49450 PDF预览

LM49450

更新时间: 2024-02-01 00:31:03
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
42页 1037K
描述
Boomer I2S Input, 2.5W/Channel, Low EMI, Stereo, Class D Audio Sub-System with Ground Referenced Headphone Amplifier, 3D Enhancement, and Headphone Sense

LM49450 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:HVQCCN, LCC28,.2SQ,20
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01Factory Lead Time:8 weeks
风险等级:5.48商用集成电路类型:AUDIO AMPLIFIER
JESD-30 代码:S-PQCC-N32JESD-609代码:e3
长度:5 mm湿度敏感等级:1
功能数量:2端子数量:28
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:HVQCCN
封装等效代码:LCC28,.2SQ,20封装形状:SQUARE
封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE峰值回流温度(摄氏度):260
电源:3.6/5 V认证状态:Not Qualified
筛选级别:AEC-Q100座面最大高度:0.8 mm
子类别:Audio/Video Amplifiers最大供电电压 (Vsup):5.5 V
表面贴装:YES温度等级:INDUSTRIAL
端子面层:Matte Tin (Sn)端子形式:NO LEAD
端子节距:0.5 mm端子位置:QUAD
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:5 mm
Base Number Matches:1

LM49450 数据手册

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LM49450  
www.ti.com  
SNAS440D FEBRUARY 2008REVISED MAY 2013  
f = 1 / 2πRINCIN  
where  
the value of RIN is typically 20kΩ  
(1)  
The input capacitors can also be used to remove low frequency content from the audio signal. Small speakers  
cannot reproduce, and may even be damaged by low frequencies. High pass filtering the audio signal helps  
protect the speakers. When the LM49450 is using a single-ended source, power supply noise on the ground is  
seen as an input signal. Setting the high-pass filter point above the power supply noise frequencies, 217Hz in a  
GSM phone, for example, filters out the noise such that it is not amplified and heard on the output. Capacitors  
with a tolerance of 10% or better are recommended for impedance matching and improved CMRR and PSRR.  
PCB Layout Guidelines  
Minimize trace impedance of the power, ground and all output traces for optimum performance. Voltage loss due  
to trace resistance between the LM49450 and the load results in decreased output power and efficiency. Trace  
resistance between the power supply and ground has the same effect as a poorly regulated supply, increased  
ripple and reduced peak output power. Use wide traces for power supply inputs and amplifier outputs to minimize  
losses due to trace resistance, as well as route heat away from the device. Proper grounding improves audio  
performance, minimizes crosstalk between channels and prevents switching noise from interfering with the audio  
signal. Use of power and ground planes is recommended.  
Place all digital components and route digital signal traces as far as possible from analog components and  
traces. Do not run digital and analog traces in parallel on the same PCB layer. If digital and analog signal lines  
must cross either over or under each other, ensure that they cross in a perpendicular fashion.  
Exposed DAP Mounting Considerations  
The LM49450 WQFN package features an exposed die-attach (thermal) pad on its backside. The exposed pad  
provides a direct heat conduction path from the die to the PCB, reducing the thermal resistance of the package.  
Connect the exposed pad to GND with a large pad and via to a large GND plane on the bottom of the PCB for  
best heat distribution.  
Revision Table  
Rev  
1.0  
Date  
Description  
12/18/07  
09/26/08  
Initial release.  
1.01  
Corrected the package drawing.  
On Table 5 (Common DAC Clock..., col DAC MODE = 2b01... sample 8...), changed  
2.084 to 2.048.  
1.02  
D
08/04/11  
05/03/13  
Changed layout of National Data Sheet to TI format.  
Copyright © 2008–2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
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Product Folder Links: LM49450  

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