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LM4871LD PDF预览

LM4871LD

更新时间: 2024-02-19 05:42:00
品牌 Logo 应用领域
德州仪器 - TI 放大器功率放大器
页数 文件大小 规格书
23页 1234K
描述
3W Audio Power Amplifier with Shutdown Mode

LM4871LD 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:DIP,Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.33.00.01
风险等级:5.82标称带宽:20 kHz
商用集成电路类型:AUDIO AMPLIFIER谐波失真:10%
JESD-30 代码:R-PDIP-T8JESD-609代码:e3
长度:9.817 mm湿度敏感等级:1
信道数量:1功能数量:1
端子数量:8最高工作温度:85 °C
最低工作温度:-40 °C标称输出功率:1.5 W
封装主体材料:PLASTIC/EPOXY封装代码:DIP
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):260认证状态:Not Qualified
座面最大高度:5.08 mm最大压摆率:10 mA
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):2 V
表面贴装:NO温度等级:INDUSTRIAL
端子面层:TIN端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:7.62 mm

LM4871LD 数据手册

 浏览型号LM4871LD的Datasheet PDF文件第2页浏览型号LM4871LD的Datasheet PDF文件第3页浏览型号LM4871LD的Datasheet PDF文件第4页浏览型号LM4871LD的Datasheet PDF文件第6页浏览型号LM4871LD的Datasheet PDF文件第7页浏览型号LM4871LD的Datasheet PDF文件第8页 
LM4871  
www.ti.com  
SNAS002F FEBRUARY 2000REVISED MAY 2013  
Typical Performance Characteristics  
NGN Specific Characteristics  
LM4871LD THD+N vs Output Power  
LM4871LD THD+N vs Frequency  
Figure 4.  
Figure 5.  
LM4871LD THD+N vs Frequency  
LM4871LD THD+N vs Output Power  
Figure 6.  
Figure 7.  
LM4871LD Power Dissipation vs Output Power  
LM4871LD Power Derating Curve  
This curve shows the LM4871LD's thermal dissipation ability at  
different ambient temperatures given the exposed-DAP of the part is  
soldered to a plane of 1oz. Cu with an area given in the label of each  
curve. This label also designates whether the plane exists on the  
same (top) layer as the chip, on the bottom layer, or on both layers.  
Infinite heatsink and unattached (no heatsink) conditions are also  
shown.  
Figure 8.  
Figure 9.  
Copyright © 2000–2013, Texas Instruments Incorporated  
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Product Folder Links: LM4871  
 

LM4871LD 替代型号

型号 品牌 替代类型 描述 数据表
LM4871LDX/NOPB TI

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