LAA110
INTEGRATED
CIRCUITS
DIVISION
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of
the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of
our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices
when handled according to the limitations and information in that standard as well as to any limitations set forth in the
information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
c
Device
Moisture Sensitivity Level (MSL) Classification
LAA110S / LAA110P
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum dwell time
the body temperature of these surface mount devices may be (TC - 5)°C or greater.The Classification Temperature sets
the Maximum Body Temperature allowed for these devices during reflow soldering processes.
Device
ClassificationTemperature (Tc)
DwellTime (tP)
Max Reflow Cycles
LAA110S
LAA110P
250ºC
260ºC
30 Seconds
30 seconds
3
3
For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided
in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they
exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During
this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of
the device must not exceed the limit shown in the table below at any time during the soldering process.
Device
Maximum PinTemperature Maximum BodyTemperature
260ºC 250ºC
MaximumTotal DwellTime
Wave Cycles
LAA110
10 seconds
1
Board Wash
IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove
flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent
damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a
follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to
the variability of the wash parameters used to clean the board, determination of the bake temperature and duration
necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning
or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the
device must not be exposed to halide flux or solvents.
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