Datasheet > L2520101R0M-10

L2520101R0M-10

更新时间： 2023-12-06 20:13:34

品牌	Logo	应用领域
SUPERWORLD		/
页数	文件大小	规格书
9页	420K
描述
Length (mm): 2.50 \| Width (mm): 2.00 \| Height (mm): 0.90 \| SPQ (reel) : 3000 Design of multilayer construction with excellent reliability. Small form factor, low profile, high current capability.

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L2520101R0M-10 数据手册

Power Inductor – L252010FW Series

Table (1.1): Reflow Profiles

Profile Type:

Pb-Free Assembly

Preheat

-Temperature Min(T_smin

)

-Temperature Max(T_smax

150℃

200℃

60-120seconds

)

-Time(t_s)from(T_sminto T_smax

)

Ramp-up rate(T_Lto T_p)

3℃/second max.

217℃

60-150 seconds

Liquidus temperature(T_L)

Time(t_L)maintained above T_L

Classification temperature(T_c)

See Table (1.2)

Time(t_p) at Tc- 5℃ (Tp should be equal to or less than Tc.)

Ramp-down rate(T_pto T_L)

* 30 seconds

6℃ /second max.

Time 25℃ to peak temperature

8 minutes max.

Tp: maximum peak package body temperature, Tc: the classification temperature.

For user (customer) Tp should be equal to or less than Tc.

* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.

Table (1.2) Package Thickness/Volume and Classification Temperature (T_c)

Volume mm³

350-2000

Package

Thickness

Volume mm³

<350

Volume

mm³>2000

<1.6mm

1.6-2.5mm

≥2.5mm

260℃

250℃

260℃

250℃

245℃

260℃

245℃

PB-Free

Assembly

Reflow is referred to standard IPC/JEDEC J-STD-020E

8. Packaging Information

8-1 Reel Dimension

Type

A(mm)

B(mm)

60 2

C(mm)

13.5 0.5

D(mm)

178 2

7”x8mm

9.0 0.5

NOTE: Specifications subject to change without notice. Please check our website for latest information.

Proprietary and Confidential

Document of Superworld

06/10/2021

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